Cypress Semiconductor Corp S25FL064P0XMFI003

Mfr.Part #:

S25FL064P0XMFI003
Description:
IC FLASH 64MBIT 104MHZ 16SOIC

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Factory Lead Time
8 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

16-SOIC (0.295, 7.50mm Width)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

16
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

FL-P
Published
2013
JESD-609 Code
e3
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
16
ECCN Code
3A991.B.1.A
HTS Code
8542.32.00.51
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3V
Terminal Pitch
1.27mm
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

SPI, Serial
Memory Size
64Mb 8M x 8
Nominal Supply Current
26mA
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Non-Volatile
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

104MHz
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

8 ns
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

FLASH
Memory Interface
SPI - Quad I/O
Data Bus Width

Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

8b
Organization
64MX1
Memory Width
1
Write Cycle Time - Word, Page
5μs, 3ms
Address Bus Width
1b
Density
64 Mb
Standby Current-Max
0.00001A
Sync/Async
Synchronous
Word Size
1b
Programming Voltage
3V
Serial Bus Type
SPI
Endurance
100000 Write/Erase Cycles
Data Retention Time-Min
20
Write Protection
HARDWARE/SOFTWARE
Page Size
256B
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

10.3mm
Height Seated (Max)
2.65mm
REACH SVHC
No SVHC
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Description
The Cypress S25FL064P is a 64-Mbit SPI Flash memory device with a 3.0 V power supply. It features a single power supply operation with a full voltage range of 2.7 to 3.6 V for both read and write operations. The memory architecture consists of uniform 64-kB sectors, a top or bottom parameter block, and a 256-byte page size. It is backward compatible with the S25FL064A device.

Features
Architectural Advantages:
Single power supply operation
Uniform 64-kB sectors
Top or bottom parameter block
256-byte page size
Backward compatible with S25FL064A
Program:
Page Program (up to 256 bytes) in 1.5 ms (typical)
Page by page program operations
Accelerated programming mode via 9V W#/ACC pin
Quad Page Programming
Erase:
Bulk erase function
Sector erase (SE) command for 64-kB sectors
Sub-sector erase (P4E) command for 4-kB sectors
Sub-sector erase (P8E) command for 8-kB sectors
Cycling Endurance:
100,000 cycles per sector typical
Data Retention:
20 years typical
Device ID:
JEDEC standard two-byte electronic signature
RES command one-byte electronic signature for backward compatibility
One Time Programmable (OTP) Area:
For permanent, secure identification
Can be programmed and locked at the factory or by the customer
CFI (Common Flash Interface) Compliant:
Allows host system to identify and accommodate multiple flash devices
Process Technology:
Manufactured on 90-nm MirrorBit process technology
Package Options:
Industry Standard Pinouts
16-pin SO package (300 mills)
8-contact WSON package (6 x 8 mm)
24-ball BGA package (6 x 8 mm), 5 x 5 pin configuration
24-ball BGA package (6 x 8 mm), 6x4 pin configuration
Performance Characteristics:
Speed:
Normal READ (Serial): 40 MHz clock rate
FAST READ (Serial): 104 MHz clock rate (maximum)
DUAL I/O FAST READ: 80 MHz clock rate or 20 MB/s effective data rate
QUAD I/O FAST READ: 80 MHz clock rate or 40 MB/s effective data rate
Power Saving Standby Mode:
Standby Mode 80 μA (typical)
Deep Power-Down Mode 3 μA (typical)
Memory Protection Features:
Memory Protection:
W#/ACC pin works in conjunction with Status Register Bits to protect specified memory areas
Status Register Block Protection bits (BP2, BP1, BPO) in status register configure parts of memory as read-only
Software Features:
SPI Bus Compatible Serial Interface

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