Factory Lead Time
4 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
16-VFQFN Exposed Pad
Supplier Device Package
16-QFN (3x3)
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Applications
Optical Networks
RoHS Status
ROHS3 Compliant
Description
The SY88053CL limiting post amplifier is designed for use in fiber-optic receivers for multi-rate applications from 1.0625Gbps to 12.5Gbps. It features a high-bandwidth, high-sensitivity input stage with user-programmable, wide-range SD assert/LOS de-assert threshold levels, enabling optimized system reach. The input stage also provides a user-adjustable decision threshold circuit to optimize BER in noisy applications. The SY88053CL operates from a single 3.3V power supply, over temperatures ranging from -40°C to 85°C.
Features
Multi-rate operation from 1.0625Gbps to 12.5Gbps
Adjustable decision threshold level for offset compensation or BER optimization
Wide differential input range (5mVpp to 1800mVpp)
Wide SD de-assert or LOS assert threshold range (3mVpp to 30mVpp)
4dB typical electrical hysteresis
Fast SD assert and LOS de-assert times (75ns typical; 120ns maximum)
Selectable LOS or SD status signal indicator
Selectable RXOUT /RXOUT- polarity inversion
TTL-compatible JAM input with internal pull-up
Low-noise CML data inputs with integrated 500 termination impedance to internal reference VREF
Low-noise CML data outputs with integrated 500 termination impedance (25ps typical rise/fall times)
Wide range power supply: 3.3V ±10%
Industrial temperature range: -40°C to 85°C
Available in a tiny 3mm x 3mm QFN package
Applications
Asymmetrical/Symmetrical 10GEPON
Asymmetrical/Symmetrical XGPON
10Gigabit Ethernet
8Gbps and 10Gbps Fibre Channel
SONET OC192; SDH STM64
WDM/DWDM systems
PON/FTTx
Datacom/Enterprise
Storage area networks
High-performance computing
Telecom
8G Optical transceivers
