Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
16-VFQFN Exposed Pad, 16-MLF®
Supplier Device Package
16-MLF® (3x3)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Discontinued
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Applications
Optical Networks
RoHS Status
Non-RoHS Compliant
Description
The SY88983V is a low-power limiting post amplifier designed for use in fiber optic receivers. It connects to typical transimpedance amplifiers (TIAs) and quantizes the linear signal output from TIAs, producing voltage-limited waveforms with an output swing of typically 800mVpp.
The SY88983V operates from a single 3.3V ±10% or 5V ±10% power supply, over the industrial temperature of -40°C to 85°C. With its wide bandwidth and high gain, signals with data rates up to 3.2Gbps and as small as 10mVpp can be amplified to drive devices with CML inputs or AC-coupled PECL inputs.
The SY88983V generates a signal detect (SD) open-collector TTL output with internal 5k2 pull-up resistor. A programmable signal detect level set pin (SDLVL) sets the sensitivity of the input amplitude detection. SD asserts high if the input amplitude rises above the threshold set by SDLVL and de-asserts low otherwise. SD can be fed back to the enable (EN) input to maintain output stability under a loss-of-signal condition. EN de-asserts the true output signal without removing the input signal. Typically, 4.6dB SD hysteresis is provided to prevent chattering.
Features
Multi-Rate up to 3.2Gbps operation
Wide gain-bandwidth product (38dB differential gain)
2.2GHz 3dB bandwidth
Low noise 50Ω CML data outputs
800mVpp output swing
60ps edge rates
5psrms typ. random jitter
15pspp typ. deterministic jitter
Chatter-free Signal Detect (SD) output
4.6dB electrical hysteresis
OC-TTL output with internal 5kΩ pull-up resistor
Programmable SD sensitivity using single external resistor
Internal 50Ω data input termination
TTL EN input allows feedback from SD
Wide operating range
Single 3.3V ±10% or 5V ±10% power supply
-40°C to 85°C industrial temperature range
Available in tiny 10-pin MSOP (3mm) and 16-pin MLF™ (3mm x 3mm) packages
Applications
1.25Gbps and 2.5Gbps Gigabit Ethernet
1.062Gbps and 2.125Gbps Fibre Channel
155Mbps, 622Mbps, 1.25Gbps and 2.5Gbps SONET/SDH
Gigabit interface converter (GBIC)
Small form factor (SFF) and small form factor pluggable (SFP) transceivers
Parallel 10G Ethernet
High-gain line driver and line receiver
