Factory Lead Time
6 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
36-VFQFN Exposed Pad
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~125°C TJ
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Applications
General Purpose
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
Power MOSFET
Voltage - Supply
5.5V~46V
Function
Function refers to the primary purpose or role of an electronic component within a circuit. It describes the specific task or operation that the component is designed to perform. For example, a resistor's function is to limit current flow, a capacitor's function is to store electrical energy, and a transistor's function is to amplify or switch signals. Understanding the function of a component is crucial for selecting the appropriate component for a particular application and ensuring its proper operation within the circuit.
Driver - Fully Integrated, Control and Power Stage
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
SPI, Step/Direction
Output Configuration
Output Configuration refers to the arrangement of output terminals or pins on an electronic component. It specifies the number, type, and arrangement of these terminals, allowing for various connection options. This parameter is crucial for determining the component's compatibility with other devices and ensuring proper signal flow within a circuit.
Half Bridge (4)
Motor Type - Stepper
Bipolar
Step Resolution
Step Resolution refers to the smallest increment of movement or change that an electronic component can make. It is typically measured in units of degrees, steps, or counts. A higher step resolution indicates that the component can make more precise adjustments, resulting in smoother and more accurate operation. Step Resolution is a crucial parameter for components used in applications such as motors, actuators, and encoders, where precise control of movement or position is essential.
1 ~ 1/256
RoHS Status
ROHS3 Compliant
Description
The TMC2130 is a high-performance driver IC for two-phase bipolar stepper motors. It features a Step/Dir interface with microstep interpolation (MicroPlyer™) and an SPI interface. The StealthChop™ chopper ensures quiet operation, while CoolStep™ reduces energy consumption by up to 75%. DcStep™ provides load-dependent speed control, and StallGuard™ offers high-precision sensorless motor load detection. Integrated power MOSFETs handle motor currents up to 2.0A coil current (2.5A peak). The TMC2130 comes in a small 5x6mm² QFN36 or TQFP48 package.
Features
2-phase stepper motors up to 2.0A coil current (2.5A peak)
Step/Dir interface with microstep interpolation (MicroPlyer™)
SPI interface
Voltage range: 4.75..46V DC
Highest resolution: 256 microsteps per full step
StealthChop™ for extremely quiet operation and smooth motion
SpreadCycle™ highly dynamic motor control chopper
DcStep™ load-dependent speed control
StallGuard™ high-precision sensorless motor load detection
CoolStep™ current control for energy savings up to 75%
Integrated current sense option
Passive braking and freewheeling mode
Full protection & diagnostics
Small size: 5x6mm² QFN36 or TQFP48 package
Applications
Textile, sewing machines
Factory & lab automation
3D printers
Liquid handling
Medical
Office automation
CCTV, security
ATM, cash recycler
POS
Pumps and valves
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Image
Part Number
Manufacturer
Factory Lead Time
Mount
Mounting Type
Package / Case
Operating Temperature
Packaging
Published
Part Status
Moisture Sensitivity Level (MSL)
Applications
Technology
Voltage - Supply
Function
Interface
Output Configuration
Current - Output
Logic Function
Voltage - Load
Motor Type - Stepper
Step Resolution
RoHS Status
Number of Pins
HTS Code
Number of Outputs
Output Voltage
Output Current
Motor Type
REACH SVHC
View Compare
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TMC2130-LA-T
6 Weeks
Surface Mount
Surface Mount
36-VFQFN Exposed Pad
-40°C~125°C TJ
Tape & Reel (TR)
2016
Active
3 (168 Hours)
General Purpose
Power MOSFET
5.5V~46V
Driver - Fully Integrated, Control and Power Stage
SPI, Step/Direction
Half Bridge (4)
1.2A
AND
5.5V~46V
Bipolar
1 ~ 1/256
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
6 Weeks
Surface Mount
Surface Mount
32-VFQFN Exposed Pad
-40°C~125°C TJ
Tray
2012
Active
3 (168 Hours)
General Purpose
Power MOSFET
3.3V~5V
Controller - Commutation, Direction Management
SPI, Step/Direction
Pre-Driver - Half Bridge (3)
-
-
9V~60V
Multiphase
1 ~ 1/256
ROHS3 Compliant
32
8542.31.00.01
6
10V
15mA
Stepper
No SVHC
-
6 Weeks
Surface Mount
Surface Mount
48-VFQFN Exposed Pad
-40°C~125°C TJ
Cut Tape (CT)
2016
Active
3 (168 Hours)
General Purpose
Power MOSFET
5.5V~26V
Driver - Fully Integrated, Control and Power Stage
SPI, Step/Direction
Half Bridge (8)
1.1A
AND
5.5V~26V
Bipolar
1 ~ 1/256
ROHS3 Compliant
-
-
-
-
-
-
-