Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
24-TSSOP (0.173, 4.40mm Width) Exposed Pad
Supplier Device Package
24-HTSSOP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Feature
Depop, Differential Inputs, Input Multiplexer, Shutdown, Volume Control
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
2 (1 Year)
Voltage - Supply
4.5V~5.5V
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
2-Channel (Stereo) with Stereo Headphones
Max Output Power x Channels @ Load
2.8W x 2 @ 3Ohm
RoHS Status
ROHS3 Compliant
Description
The TPA0132 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of delivering 2.8 W of continuous RMS power per channel into 3-2 loads. This device minimizes the number of external components needed, which simplifies the design and frees up board space for other features. When driving 1 W into 8-2 speakers, the TPA0132 has less than 0.4% THD N across its specified frequency range. Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in the speakers.
Amplifier gain is controlled by means of a dc voltage input on the VOLUME terminal. There are 31 discrete steps covering the range of 20 dB (maximum volume setting) to -40 dB (minimum volume setting) in 2-dB steps. When the VOLUME terminal exceeds 3.54 V, the device is muted. An internal input MUX allows two sets of stereo inputs to the amplifier. In notebook applications, where internal speakers are driven as bridge-tied load (BTL) and the line outputs (often headphone drive) are required to be single-ended (SE), the TPA0132 automatically switches into SE mode when the SE/BTC input is activated, and this effectively reduces the gain by 6 dB.
The TPA0132 consumes only 10 mA of supply current during normal operation. A shutdown mode is included that reduces the supply current to 150 μA.
The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only in TO-220-type packages. Thermal impedances of approximately 35°C/W are readily realized in multilayer PCB applications. This allows the TPA0132 to operate at full power into 8-2 loads at ambient temperatures of 85°C.
Features
Compatible with PC 99 Desktop Line-Out into 10-k Load
Compatible with PC 99 Portable into 8-2 Load
Internal Gain Control, which Eliminates External Gain-Setting Resistors
DC Volume Control from 20 dB to -40 dB
2.8-W/Ch Output Power into a 3-2 Load
PC-Beep Input
Depop Circuitry
Stereo Input MUX
Fully Differential Input
Low Supply Current and Shutdown Current
Surface-Mount Power Packaging 24-Pin TSSOP PowerPAD™
Applications
Notebook Computers
Desktop Computers
Portable Audio Devices
Home Audio Systems
Car Audio Systems
