Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
HTSSOP EP
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
20
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
2 (1 Year)
Number of Terminations
20
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Subcategory
Other Regulators
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
PMOS
Peak Reflow Temperature (Cel)
260
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
1
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
Fixed
Polarity
Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.
Positive
Power Dissipation-Max
7.2W
Power Dissipation
Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.
7.2W
Quiescent Current
Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.
125μA
Accuracy
Accuracy refers to the closeness of a measured value to the true value. In electronic components, accuracy is typically expressed as a percentage of the full-scale range. For example, a component with an accuracy of ±2% would have a measured value that is within 2% of the true value. Accuracy is important in electronic components because it ensures that the component will perform as expected.
2 %
Current - Input Bias
85μA
Dropout Voltage1-Nom
0.26V
Output Voltage Accuracy
Output Voltage Accuracy is a measure of how closely the output voltage of a component matches its ideal or expected value. It is typically expressed as a percentage of the ideal voltage, and indicates the maximum deviation from the ideal that can be expected under specified operating conditions. For example, an output voltage accuracy of ±2% means that the output voltage can vary by up to 2% above or below the ideal value.
2 %
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
1.15mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
6.5mm
RoHS Status
RoHS Compliant
Description
The TPS777xx and TPS778xx are fast-transient-response, 750-mA low-dropout linear regulators. They are designed to be stable with a 10 μF low ESR capacitor, providing high performance at a reasonable cost.
Features
Open Drain Power-On Reset With 200 ms Delay (TPS777xx)
Open Drain Power Good (TPS778xx)
750-mA Low-Dropout Voltage Regulator
Available in 1.5-V, 1.8-V, 2.5-V, 3.3-V Fixed Output and Adjustable Versions
Dropout Voltage to 260 mV (Typ) at 750 mA (TPS77x33)
Ultralow 85 μA Typical Quiescent Current
Fast Transient Response
2% Tolerance Over Specified Conditions for Fixed-Output Versions
8-Pin SOIC and 20-Pin TSSOP PowerPAD™ (PWP) Package
Thermal Shutdown Protection
Applications
Cellular phones
PDAs
Digital cameras
Portable instruments
Battery-powered systems