Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
303-CBGA
Supplier Device Package
303-CBGA (25x21)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C~125°C
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Voltage - Supply
3.135V~3.465V
RoHS Status
Non-RoHS Compliant
Description
The TSPC106 is a high-performance, TTL-compatible interface between a 60x processor, a secondary (L2) cache, up to four additional 60x processors, the PCI bus, and main memory. It supports PCI Specification Revision 2.1 and operates at 20 to 33 MHz with 3.3V/5.0V compatibility. The TSPC106 integrates system testability and debugging features via JTAG boundary-scan capability.
Features
Processor Bus Frequency: Up to 66 MHz and 83.3 MHz
64-bit Data Bus and 32-bit Address Bus
L2 Cache Control for 256-Kbyte, 512-Kbyte, 1-Mbyte Sizes
Support for Asynchronous SRAM, Burst SRAM, or Pipelined Burst SRAM
PCI Interface Compliant with Revision 2.1
IEEE 1149.1-compliant, JTAG Boundary-scan Interface
Low Power Consumption: Po Max = 1.7 Watts (66 MHz)
Nap, Doze, and Sleep Modes
Fully Compliant with MIL-STD-883 Class Q or Atmel Standards
Upscreenings Based on Atmel Standards
Full Military Temperature Range (-55°C to 125°C)
Industrial Temperature Range (-40°C to 110°C)
Vcc: 3.3V ± 5%
Available in a 303-ball CBGA or a 303-ball CBGA with Solder Column Interposer (SCI) (CI-CGA) Package
Applications
High-performance embedded systems
Military and aerospace applications
Industrial control systems
Medical imaging systems
Telecommunications systems
