Lifecycle Status
ACTIVE (Last Updated: 1 week ago)
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
100
RoHS Status
Non-RoHS Compliant
3-1333206-9 OverviewThis product is manufactured by TE Connectivity AMP Connectors and belongs to the category of Crimpers, Applicators, Presses - Accessories. The images we provide are for reference only, for detailed product information please see specification sheet 3-1333206-9 or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of 3-1333206-9. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
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