Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
SOT-23-8
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
8
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C~125°C
Packaging
Tape & Reel (TR)
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
74V
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3.3V
Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
2V
Quiescent Current
Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.
1μA
Turn On Delay Time
10.5 ns
Logic Function
Buffer, Inverter
Current - Output High, Low
8mA 8mA
Logic Type
Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.
Inverter
Max Propagation Delay @ V, Max CL
6.5ns @ 5V, 50pF
Logic Level - Low
0.9V ~ 1.65V
Logic Level - High
Logic Level - High refers to the voltage level that represents a logical "1" in a digital circuit. It is typically defined as a voltage range that is higher than a specified threshold voltage. The specific value of the Logic Level - High depends on the logic family being used, such as TTL, CMOS, or ECL. For example, in TTL logic, the Logic Level - High is typically defined as a voltage between 2.4V and 5V.
2.2V ~ 3.85V
Height Seated (Max)
1.45mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
2.9mm
RoHS Status
ROHS3 Compliant
Description
The 74V2G14 is a high-speed CMOS triple Schmitt trigger inverter fabricated with sub-micron silicon gate and double-layer metal wiring C²MOS technology. It features:
High speed: tpp = 3.0ns (TYP.) at Vcc = 5V
Low power dissipation: Icc 1μA (MAX.) at TA = 25°C
Typical hysteresis: V₁ = 800mV at Vcc = 4.5V, V₁ = 500mV at Vcc = 3.0V
Power down protection on inputs and outputs
Symmetrical output impedance: lloH, loL 8mA (MIN) at Vcc 4.5V, lloH, loL 4mA (MIN) at Vcc = 3.0V
Balanced propagation delays: PLH, PHL
Operating voltage range: Vcc(OPR) 2V to 5.5V
Improved latch-up immunity
Features
High speed
Low power dissipation
Typical hysteresis
Power down protection
Symmetrical output impedance
Balanced propagation delays
Wide operating voltage range
Improved latch-up immunity
Applications
Interface 5V to 3V systems
Portable applications (personal digital assistants, camcorders, battery-powered equipment)