Microchip Technology ATXMEGA32A4U-M7

Mfr.Part #:

ATXMEGA32A4U-M7

Manufacturer:

Description:
IC MCU 8BIT 32KB FLASH 44VQFN

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Contact Plating
Gold
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

44-VFQFN Exposed Pad
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

44
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~105°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

AVR® XMEGA® A4U
Published
2013
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
44
Additional Feature
IT IS ALSO OPERATES IN 12 MHZ AT 1.6 V MINIMUM
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3V
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

32MHz
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
ATXMEGA32
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

I2C, IrDA, SPI, UART, USART, USB
Memory Size
32kB
Oscillator Type
Internal
Number of I/O
34
RAM Size
4K x 8
Voltage - Supply (Vcc/Vdd)
1.6V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

AVR
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size

Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

8/16-Bit
Program Memory Size
32KB 16K x 16
Connectivity

Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

I2C, IrDA, SPI, UART/USART, USB
Bit Size
16
Data Converter
A/D 12x12b; D/A 2x12b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
YES
Number of Timers/Counters
5
EEPROM Size
1K x 8
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

7mm
Height Seated (Max)
1mm
Width
7mm
RoHS Status
ROHS3 Compliant
Description
The Microchip AVR XMEGA® is a family of low-power, high-performance, and peripheral-rich 8/16-bit microcontrollers based on the AVR enhanced RISC architecture. With single-cycle instruction execution, these devices achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz.

Features
Nonvolatile program and data memories:
16K-128KB in-system self-programmable flash
4K-8KB boot section
1K-2KB EEPROM
2K-8KB internal SRAM
Peripheral Features:
Four-channel DMA controller
Eight-channel event system
Five 16-bit timer/counters with 4 output compare or input capture channels
Two timer/counters with 2 output compare or input capture channels
High-resolution extensions on all timer/counters
Advanced waveform extension (AWEX) on one timer/counter
One USB device interface (USB 2.0 full speed and low speed compliant)
32 Endpoints with full configuration flexibility
Five USARTS with IrDA support for one USART
Two Two-wire interfaces with dual address match (I²C and SMBus compatible)
Two serial peripheral interfaces (SPIs)
AES and DES crypto engine
CRC-16 (CRC-CCITT) and CRC-32 (IEEE 802.3) generator

Applications
Industrial control
Automotive
Medical
Consumer electronics
Communications
No Product Comparison