Infineon Technologies BCR135SH6327XTSA1

Mfr.Part #:

BCR135SH6327XTSA1

Manufacturer:

Description:
TRANS 2NPN PREBIAS 0.25W SOT363

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Factory Lead Time
26 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

6-VSSOP, SC-88, SOT-363
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

6
Supplier Device Package
PG-SOT363-6
Packaging
Tape & Reel (TR)
Published
2011
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Not For New Designs
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Max Operating Temperature
150°C
Min Operating Temperature
-65°C
Max Power Dissipation
250mW
Base Part Number
BCR135S
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

NPN
Element Configuration
Dual
Power - Max
250mW
Halogen Free
Halogen Free
Transistor Type

Transistor Type refers to the specific type of transistor used in an electronic circuit. Transistors are semiconductor devices that act as switches or amplifiers, and different types have different characteristics and applications. Common transistor types include Bipolar Junction Transistors (BJTs), Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), and Insulated-Gate Bipolar Transistors (IGBTs). Each type has its own advantages and disadvantages, such as speed, power handling, and voltage range, and is suitable for specific applications.

2 NPN - Pre-Biased (Dual)
Collector Emitter Voltage (VCEO)

Collector-Emitter Voltage (VCEO) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor when it is in the off state. It is important to ensure that the VCEO rating of a transistor is not exceeded, as this can lead to damage to the device. The VCEO rating is typically specified in the datasheet for a transistor.

300mV
Max Collector Current
100mA
DC Current Gain (hFE) (Min) @ Ic, Vce
70 @ 5mA 5V
Vce Saturation (Max) @ Ib, Ic
300mV @ 500μA, 10mA
Collector Emitter Breakdown Voltage
50V
Voltage - Collector Emitter Breakdown (Max)
50V
Current - Collector (Ic) (Max)
100mA
Collector Emitter Saturation Voltage
300mV
Max Breakdown Voltage
50V
Frequency - Transition
150MHz
hFE Min
70
Resistor - Base (R1)
10kOhms
Resistor - Emitter Base (R2)
47kOhms
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

800μm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

2mm
Width
1.25mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
BCR135SH6327XTSA1 Overview
This product is manufactured by Infineon Technologies and belongs to the category of Transistors - Bipolar (BJT) - Arrays, Pre-Biased. The images we provide are for reference only, for detailed product information please see specification sheet BCR135SH6327XTSA1 or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of BCR135SH6327XTSA1. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
BCR135SH6327XTSA1 More Descriptions
BCR135 Series NPN 50 V 100 mA SMT Silicon Digital Transistor - SOT-363-6
Trans Digital BJT NPN 50V 100mA 250mW Automotive 6-Pin SOT-363 T/R
Bipolar Transistors - Pre-Biased AF DIGITAL TRANSISTOR
Digital Trans, 50V, 10K/47K, Sot-363-6; Digital Transistor Polarity:Dual Npn; Collector Emitter Voltage V(Br)Ceo:50V; Continuous Collector Current Ic:100Ma; Base Input Resistor R1:10Kohm; Base-Emitter Resistor R2:47Kohm; Resistor Rohs Compliant: Yes |Infineon BCR135SH6327XTSA1
NPN Silicon Digital Transistor | Summary of Features: Switching circuit, inverter, interface circuit driver circuit; Built in bias resistor (R1=10 k, R2=47 k) BCR135S: Two internally isolated transistors with good matching in one multichip package; BCR135S: For orientation in reel see package information below; Pb-free (RoHS compliant) package1); Qualified according AEC Q101
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