KEMET C0805X519C8HACAUTO

Mfr.Part #:

C0805X519C8HACAUTO

Manufacturer:

Description:
SMD Auto X8R HT150C Flex 5.1pF Ceramic Capacitor ±0.25pF X8R 0.079Lx0.049W 2.00mmx1.25mm -55°C~150°C Low ESL, Soft Termination, High Temperature Surface Mount, MLCC 0805 (2012 Metric)

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
36 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount, MLCC
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

0805 (2012 Metric)
Dielectric Material
Ceramic
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-55°C~150°C
Packaging
Tape & Reel (TR)
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

SMD Auto X8R HT150C Flex
Size / Dimension
0.079Lx0.049W 2.00mmx1.25mm
Tolerance

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

±0.25pF
Feature
Low ESL, Soft Termination, High Temperature
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Temperature Coefficient

Temperature Coefficient (TC) measures the relative change in a component's value due to temperature variations. It is expressed as a percentage change per degree Celsius (°C). A positive TC indicates an increase in value with increasing temperature, while a negative TC indicates a decrease. TC is crucial for ensuring stable circuit performance over a range of temperatures. It helps designers compensate for temperature-induced changes and maintain desired component characteristics.

X8R
Applications
Automotive, Boardflex Sensitive
Capacitance

Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.

5.1pF
Voltage - Rated DC
10V
Thickness (Max)
0.039 0.98mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Ratings
AEC-Q200
C0805X519C8HACAUTO Overview
Programs on this device are of 0.079Lx0.049W 2.00mmx1.25mm size/dimension.Temperature coefficient of resistance refers to the change in electrical resistance of a substance per degree change in temperature, with X8R being the highest temperature coefficient.The unit can operate at 10V Volts DC - Rated DC.

C0805X519C8HACAUTO Features
a size/dimension of 0.079Lx0.049W 2.00mmx1.25mm
with X8R being the highest temperature coefficient
with the voltage - Rated DC of 10V


C0805X519C8HACAUTO Applications
There are a lot of KEMET
C0805X519C8HACAUTO applications of ceramic capacitors.


General electronic equipment
Mobile devices
Servers, PCs, tablets
Power supply circuit
C0805X519C8HACAUTO More Descriptions
CAP CER 0805 5.1PF 10V ULTRA STA
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Dielectric Material
    Operating Temperature
    Packaging
    Series
    Size / Dimension
    Tolerance
    Feature
    Part Status
    Moisture Sensitivity Level (MSL)
    Temperature Coefficient
    Applications
    Capacitance
    Voltage - Rated DC
    Thickness (Max)
    RoHS Status
    Lead Free
    Ratings
    Mount
    Terminal Shape
    Published
    JESD-609 Code
    Pbfree Code
    Number of Terminations
    Termination
    ECCN Code
    Terminal Finish
    HTS Code
    Packing Method
    Depth
    Case Code (Metric)
    Case Code (Imperial)
    Temperature Characteristics Code
    Multilayer
    Height
    Length
    Thickness
    REACH SVHC
    Radiation Hardening
    Contact Plating
    Number of Pins
    Lead Pitch
    Voltage
    Dissipation Factor
    View Compare
  • C0805X519C8HACAUTO
    C0805X519C8HACAUTO
    36 Weeks
    Surface Mount, MLCC
    0805 (2012 Metric)
    Ceramic
    -55°C~150°C
    Tape & Reel (TR)
    SMD Auto X8R HT150C Flex
    0.079Lx0.049W 2.00mmx1.25mm
    ±0.25pF
    Low ESL, Soft Termination, High Temperature
    Active
    1 (Unlimited)
    X8R
    Automotive, Boardflex Sensitive
    5.1pF
    10V
    0.039 0.98mm
    ROHS3 Compliant
    Lead Free
    AEC-Q200
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • C0805C101K5RACTU
    8 Weeks
    Surface Mount, MLCC
    0805 (2012 Metric)
    Ceramic
    -55°C~125°C
    Tape & Reel (TR)
    SMD Comm X7R
    0.079Lx0.049W 2.00mmx1.25mm
    ±10%
    -
    Active
    1 (Unlimited)
    X7R
    Bypass, Decoupling
    100pF
    50V
    0.035 0.88mm
    ROHS3 Compliant
    -
    -
    Surface Mount
    WRAPAROUND
    2014
    e3
    yes
    2
    SMD/SMT
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    8532.24.00.20
    TR, Punched Paper, 7 Inch
    1.25mm
    2012
    0805
    X7R
    Yes
    880μm
    2mm
    889μm
    No SVHC
    No
    -
    -
    -
    -
    -
  • C0805C103KARACTU
    8 Weeks
    Surface Mount, MLCC
    0805 (2012 Metric)
    Ceramic
    -55°C~125°C
    Tape & Reel (TR)
    SMD Comm X7R Tip-Ring
    0.079Lx0.049W 2.00mmx1.25mm
    ±10%
    -
    Active
    1 (Unlimited)
    X7R
    General Purpose
    10000pF
    250V
    0.035 0.88mm
    ROHS3 Compliant
    Lead Free
    -
    PCB, Surface Mount
    WRAPAROUND
    2005
    e3
    yes
    2
    SMD/SMT
    EAR99
    -
    -
    TR, Punched Paper, 7 Inch
    1.2mm
    2012
    0805
    X7R
    Yes
    880μm
    -
    889μm
    No SVHC
    No
    Tin
    2
    750μm
    250V
    10 %

Recommended Offers

Cypress Semiconductor Corp
MB90F543GSPF-GS-BI24
Microchip Technology
PIC16C662-10E/P
Microchip Technology
ATTINY24A-MM8R
Microchip Technology
PIC16C77-20/L
Microchip Technology
PIC16F1784-I/MV
Microchip Technology
PIC16LF1934-I/ML
Microchip Technology
PIC18LF44J10-I/P
Microchip Technology
PIC18F24K22T-I/MV
Cypress Semiconductor Corp
CY8C24423A-24PXI