Factory Lead Time
6 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
48-TQFP
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
48
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
C8051F01x
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Not For New Designs
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
48
Terminal Finish
Matte Tin (Sn)
Subcategory
Microcontrollers
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3V
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
25MHz
Base Part Number
C8051F01
Operating Supply Voltage
3V
Supply Voltage-Max (Vsup)
3.6V
Number of Channels
Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.
5
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
2-Wire, I2C, SMBus, SPI, UART, USART
Voltage - Supply (Vcc/Vdd)
2.7V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Core Processor
Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.
8051
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Program Memory Type
FLASH
Core Size
Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.
SMBus (2-Wire/I2C), SPI, UART/USART
Data Converter
A/D 8x10b; D/A 2x12b
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
25 μs
Data Bus Width
Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.
8b
Number of Timers/Counters
4
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
7mm
Height Seated (Max)
1.2mm
RoHS Status
RoHS Compliant
Description
The C8051F000/1/2/5/6/7 and C8051F010/1/2/5/6/7 are mixed-signal 32KB ISP FLASH MCU families with 12-bit (C8051F000/1/2, C8051F005/6/7) or 10-bit (C8051F010/1/2, C8051F015/6/7) SAR ADCs. They feature:
No missing codes
Programmable throughput up to 100ksps
Up to 8 external inputs programmable as single-ended or differential
Programmable amplifier gain (16, 8, 4, 2, 1, 0.5)
Data dependent windowed interrupt generator
Built-in temperature sensor (13°C)
Two 12-bit DACs
Two analog comparators with programmable hysteresis values
Configurable to generate interrupts or reset
Voltage reference (2.4V: 15 ppm/°C) available on external pin
Precision VDD monitor/brown-out detector
Features
On-chip JTAG debug and boundary scan
High-speed 8051 μC core (up to 25 MIPS throughput with 25MHz clock)
256/2304 bytes internal data RAM
32k bytes FLASH (in-system programmable in $12 byte sectors)
4 byte-wide Port 10 (all 5V tolerant)
Hardware SMBus (12CM compatible), SPI, and UART
Serial ports available concurrently
Programmable 16-bit counter/timer capture compare module array with five four general purpose 16-bit counter/timers
Bi-directional reset
Internal programmable oscillator (2-10-16MHz)
External oscillator (crystal, RC, C, or clock)
Can switch between clock sources on-the-fly
Typical operating current: 12.5mA @ 25MHz
Multiple power saving sleep and shutdown modes
64-pin TQFP, 48-pin TQFP, 32-pin LQFP
Temperature range: -40°C to 85°C
Applications
Industrial control
Medical devices
Consumer electronics
Automotive
Instrumentation