Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
20-SOIC (0.295, 7.50mm Width)
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
20
Reach Compliance Code
not_compliant
Qualification Status
Not Qualified
Operating Temperature (Max)
85°C
Operating Temperature (Min)
-40°C
Supply Voltage-Max (Vsup)
5.25V
Temperature Grade
INDUSTRIAL
Supply Voltage-Min (Vsup)
4.75V
RoHS Status
Non-RoHS Compliant
Description
The CS2082 is an ASIC that controls and monitors two airbag firing loops. The independent firing loops are low- and high-side controlled. Device communication is through a Serial Peripheral Interface (SPI) port, and includes frame error detection circuitry for data reliability. Diagnostics include squib resistance measurement and continuous monitoring for shorts to ground, shorts to battery, and for open loops. The high- and low-side drivers can be individually activated to guarantee function and to identify shorts between firing loops. Additional features include power on reset, overtemperature protection, a charge pump, high-side safing sensor closure detection, an analog multiplexer, a monitor to ensure battery potential, and a programmable monitor to ensure firing potential.
Features
Serial Input Bus
Two Squib Outputs
Low- and High-Side Control
Monitors
Squib Resistance
Short to Ground or Battery
Battery Potential
Firing Potential
Safing Sensor Detection
60 V Peak Transient Voltage
Applications
Airbag Deployment Systems
