Cypress Semiconductor Corp CY8C27643-24PVXI

Mfr.Part #:

CY8C27643-24PVXI
Description:
IC MCU 8BIT 16KB FLASH 48SSOP

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
13 Weeks
Contact Plating
Gold, Tin
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

48-BSSOP (0.295, 7.50mm Width)
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

48
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tube
Published
2004
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

PSOC®1 CY8C27xxx
JESD-609 Code
e4
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
48
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature
ALSO OPERATES AT 3V WITH 93KHZ
Subcategory
Microcontrollers
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Terminal Pitch
0.635mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

24MHz
Reflow Temperature-Max (s)
30
Base Part Number
CY8C27643
Pin Count
48
Power Supplies
3.3/5V
Supply Voltage-Min (Vsup)
4.75V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

GPIO, I2C, SPI, UART, USART
Memory Size
16kB
Oscillator Type
Internal
Number of I/O
44
RAM Size
256 x 8
Voltage - Supply (Vcc/Vdd)
3V~5.25V
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

M8C
Peripherals
POR, PWM, WDT
Program Memory Type
FLASH
Core Size

Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

8-Bit
Program Memory Size
16KB 16K x 8
Connectivity

Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

I2C, SPI, UART/USART
Supply Current-Max
8mA
Bit Size
8
Data Converter
A/D 4x14b; D/A 4x9b
Watchdog Timer
Yes
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

24 μs
Data Bus Width

Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

8b
Number of Timers/Counters
2
ROM (words)
16384
CPU Family
M8C
Boundary Scan
NO
RAM (words)
256
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

2.8mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

16mm
Width
7.6mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
The CY8C27143/CY8C27243/CY8C27443/CY8C27543/CY8C27643 are Programmable System-on-Chip™ (PSoC®) devices featuring a powerful Harvard-architecture M8C processor with speeds up to 24 MHz. These devices offer advanced peripherals (PSoC blocks) including rail-to-rail analog PSoC blocks and digital PSoC blocks, providing a wide range of functionality. They also feature precision, programmable clocking, flexible on-chip memory, and programmable pin configurations.

Features
Powerful Harvard-architecture M8C processor with speeds up to 24 MHz
Advanced peripherals (PSoC blocks):
12 rail-to-rail analog PSoC blocks (ADCs, DACs, PGAs, filters, comparators)
8 digital PSoC blocks (timers, counters, PWMs, CRC, PRS, UARTs, SPIs)
Precision, programmable clocking:
Internal 2.5% 24-/48-MHz main oscillator
Optional external oscillator up to 24 MHz
Flexible on-chip memory:
16 KB flash program storage
256-byte SRAM data storage
Programmable pin configurations:
25-mA sink, 10-mA source on all GPIOs
Pull-up, pull-down, high-Z, strong, or open-drain drive modes on all GPIOs
Additional system resources:
I²C slave, master, and multi-master to 400 kHz
Watchdog and sleep timers
User-configurable low-voltage detection (LVD)
Integrated supervisory circuit
On-chip precision voltage reference

Applications
Industrial automation
Medical devices
Consumer electronics
Automotive systems
Internet of Things (IoT) devices
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Oscillator Type
    Number of I/O
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Watchdog Timer
    Access Time
    Data Bus Width
    Number of Timers/Counters
    ROM (words)
    CPU Family
    Boundary Scan
    RAM (words)
    Height
    Length
    Width
    Radiation Hardening
    REACH SVHC
    RoHS Status
    Lead Free
    Reach Compliance Code
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Speed
    Clock Frequency
    Bus Compatibility
    Height Seated (Max)
    View Compare
  • CY8C27643-24PVXI
    CY8C27643-24PVXI
    13 Weeks
    Gold, Tin
    Surface Mount
    48-BSSOP (0.295, 7.50mm Width)
    YES
    48
    -40°C~85°C TA
    Tube
    2004
    PSOC®1 CY8C27xxx
    e4
    yes
    Active
    3 (168 Hours)
    48
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    ALSO OPERATES AT 3V WITH 93KHZ
    Microcontrollers
    CMOS
    DUAL
    GULL WING
    260
    5V
    0.635mm
    24MHz
    30
    CY8C27643
    48
    3.3/5V
    4.75V
    GPIO, I2C, SPI, UART, USART
    16kB
    Internal
    44
    256 x 8
    3V~5.25V
    M8C
    POR, PWM, WDT
    FLASH
    8-Bit
    16KB 16K x 8
    I2C, SPI, UART/USART
    8mA
    8
    A/D 4x14b; D/A 4x9b
    Yes
    24 μs
    8b
    2
    16384
    M8C
    NO
    256
    2.8mm
    16mm
    7.6mm
    No
    No SVHC
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
  • CY8C20434-12LKXI
    -
    -
    Surface Mount
    32-UFQFN Exposed Pad
    YES
    -
    -40°C~85°C TA
    Tray
    -
    PSOC®1 CY8C20xxx
    -
    -
    Obsolete
    3 (168 Hours)
    32
    -
    -
    IT ALSO OPERATES AT 2.4 V
    -
    CMOS
    QUAD
    NO LEAD
    -
    3V
    0.5mm
    -
    -
    -
    32
    -
    2.4V
    -
    -
    Internal
    28
    512 x 8
    2.4V~5.25V
    M8C
    LVD, POR, WDT
    FLASH
    8-Bit
    8KB 8K x 8
    I2C, SPI
    -
    -
    -
    -
    -
    -
    -
    -
    -
    NO
    512
    -
    5mm
    5mm
    -
    -
    ROHS3 Compliant
    -
    unknown
    S-XQCC-N32
    5.25V
    12MHz
    12MHz
    USB
    0.6mm
  • CY8C20434-12LKXIT
    -
    -
    Surface Mount
    32-UFQFN Exposed Pad
    YES
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    PSOC®1 CY8C20xxx
    -
    -
    Obsolete
    3 (168 Hours)
    32
    -
    -
    IT ALSO OPERATES AT 2.4 V
    -
    CMOS
    QUAD
    NO LEAD
    -
    3V
    0.5mm
    -
    -
    -
    32
    -
    2.4V
    -
    -
    Internal
    28
    512 x 8
    2.4V~5.25V
    M8C
    LVD, POR, WDT
    FLASH
    8-Bit
    8KB 8K x 8
    I2C, SPI
    -
    -
    -
    -
    -
    -
    -
    -
    -
    NO
    512
    -
    5mm
    5mm
    -
    -
    ROHS3 Compliant
    -
    unknown
    S-XQCC-N32
    5.25V
    12MHz
    12MHz
    USB
    0.6mm

Recommended Offers

Microchip Technology
PIC16LC773/SO
Microchip Technology
PIC16LF1559-E/P
Infineon Technologies
AUIRS2302S
Infineon Technologies
TDA21106
Cypress Semiconductor Corp
S29GL01GP12FAI010
Texas Instruments
PDRV8305NEPHPRQ1
Infineon Technologies
AUIRS2124S
Microchip Technology
TC7106ACPL
Micron Technology Inc.
MT49H32M18FM-33:B
Maxim Integrated
MAX620EPN
Infineon Technologies
IRS2334SPBF
Microchip Technology
TC1413CPA