Factory Lead Time
13 Weeks
Contact Plating
Gold, Tin
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
48-BSSOP (0.295, 7.50mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
48
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
PSOC®1 CY8C27xxx
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
48
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature
ALSO OPERATES AT 3V WITH 93KHZ
Subcategory
Microcontrollers
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
24MHz
Reflow Temperature-Max (s)
30
Base Part Number
CY8C27643
Supply Voltage-Min (Vsup)
4.75V
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
GPIO, I2C, SPI, UART, USART
Voltage - Supply (Vcc/Vdd)
3V~5.25V
Core Processor
Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.
M8C
Peripherals
POR, PWM, WDT
Program Memory Type
FLASH
Core Size
Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.
8-Bit
Program Memory Size
16KB 16K x 8
Connectivity
Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.
I2C, SPI, UART/USART
Data Converter
A/D 4x14b; D/A 4x9b
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
24 μs
Data Bus Width
Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.
8b
Number of Timers/Counters
2
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
2.8mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
16mm
RoHS Status
ROHS3 Compliant
Description
The CY8C27143/CY8C27243/CY8C27443/CY8C27543/CY8C27643 are Programmable System-on-Chip™ (PSoC®) devices featuring a powerful Harvard-architecture M8C processor with speeds up to 24 MHz. These devices offer advanced peripherals (PSoC blocks) including rail-to-rail analog PSoC blocks and digital PSoC blocks, providing a wide range of functionality. They also feature precision, programmable clocking, flexible on-chip memory, and programmable pin configurations.
Features
Powerful Harvard-architecture M8C processor with speeds up to 24 MHz
Advanced peripherals (PSoC blocks):
12 rail-to-rail analog PSoC blocks (ADCs, DACs, PGAs, filters, comparators)
8 digital PSoC blocks (timers, counters, PWMs, CRC, PRS, UARTs, SPIs)
Precision, programmable clocking:
Internal 2.5% 24-/48-MHz main oscillator
Optional external oscillator up to 24 MHz
Flexible on-chip memory:
16 KB flash program storage
256-byte SRAM data storage
Programmable pin configurations:
25-mA sink, 10-mA source on all GPIOs
Pull-up, pull-down, high-Z, strong, or open-drain drive modes on all GPIOs
Additional system resources:
I²C slave, master, and multi-master to 400 kHz
Watchdog and sleep timers
User-configurable low-voltage detection (LVD)
Integrated supervisory circuit
On-chip precision voltage reference
Applications
Industrial automation
Medical devices
Consumer electronics
Automotive systems
Internet of Things (IoT) devices
-
Image
Part Number
Manufacturer
Factory Lead Time
Contact Plating
Mounting Type
Package / Case
Surface Mount
Number of Pins
Operating Temperature
Packaging
Published
Series
JESD-609 Code
Pbfree Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
ECCN Code
Terminal Finish
Additional Feature
Subcategory
Technology
Terminal Position
Terminal Form
Peak Reflow Temperature (Cel)
Supply Voltage
Terminal Pitch
Frequency
Reflow Temperature-Max (s)
Base Part Number
Pin Count
Power Supplies
Supply Voltage-Min (Vsup)
Interface
Memory Size
Oscillator Type
Number of I/O
RAM Size
Voltage - Supply (Vcc/Vdd)
Core Processor
Peripherals
Program Memory Type
Core Size
Program Memory Size
Connectivity
Supply Current-Max
Bit Size
Data Converter
Watchdog Timer
Access Time
Data Bus Width
Number of Timers/Counters
ROM (words)
CPU Family
Boundary Scan
RAM (words)
Height
Length
Width
Radiation Hardening
REACH SVHC
RoHS Status
Lead Free
Reach Compliance Code
JESD-30 Code
Supply Voltage-Max (Vsup)
Speed
Clock Frequency
Bus Compatibility
Height Seated (Max)
View Compare
-
CY8C27643-24PVXI
13 Weeks
Gold, Tin
Surface Mount
48-BSSOP (0.295, 7.50mm Width)
YES
48
-40°C~85°C TA
Tube
2004
PSOC®1 CY8C27xxx
e4
yes
Active
3 (168 Hours)
48
EAR99
Nickel/Palladium/Gold (Ni/Pd/Au)
ALSO OPERATES AT 3V WITH 93KHZ
Microcontrollers
CMOS
DUAL
GULL WING
260
5V
0.635mm
24MHz
30
CY8C27643
48
3.3/5V
4.75V
GPIO, I2C, SPI, UART, USART
16kB
Internal
44
256 x 8
3V~5.25V
M8C
POR, PWM, WDT
FLASH
8-Bit
16KB 16K x 8
I2C, SPI, UART/USART
8mA
8
A/D 4x14b; D/A 4x9b
Yes
24 μs
8b
2
16384
M8C
NO
256
2.8mm
16mm
7.6mm
No
No SVHC
ROHS3 Compliant
Lead Free
-
-
-
-
-
-
-
-
-
-
-
Surface Mount
32-UFQFN Exposed Pad
YES
-
-40°C~85°C TA
Tray
-
PSOC®1 CY8C20xxx
-
-
Obsolete
3 (168 Hours)
32
-
-
IT ALSO OPERATES AT 2.4 V
-
CMOS
QUAD
NO LEAD
-
3V
0.5mm
-
-
-
32
-
2.4V
-
-
Internal
28
512 x 8
2.4V~5.25V
M8C
LVD, POR, WDT
FLASH
8-Bit
8KB 8K x 8
I2C, SPI
-
-
-
-
-
-
-
-
-
NO
512
-
5mm
5mm
-
-
ROHS3 Compliant
-
unknown
S-XQCC-N32
5.25V
12MHz
12MHz
USB
0.6mm
-
-
-
Surface Mount
32-UFQFN Exposed Pad
YES
-
-40°C~85°C TA
Tape & Reel (TR)
-
PSOC®1 CY8C20xxx
-
-
Obsolete
3 (168 Hours)
32
-
-
IT ALSO OPERATES AT 2.4 V
-
CMOS
QUAD
NO LEAD
-
3V
0.5mm
-
-
-
32
-
2.4V
-
-
Internal
28
512 x 8
2.4V~5.25V
M8C
LVD, POR, WDT
FLASH
8-Bit
8KB 8K x 8
I2C, SPI
-
-
-
-
-
-
-
-
-
NO
512
-
5mm
5mm
-
-
ROHS3 Compliant
-
unknown
S-XQCC-N32
5.25V
12MHz
12MHz
USB
0.6mm