Altera EP3SE260F1517C4N

Mfr.Part #:

EP3SE260F1517C4N

Manufacturer:

Description:
IC FPGA 976 I/O 1517FBGA

RoHS Status:

RoHS

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Payment

Delivery:

Delivery

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ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
8 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

1517-BBGA, FCBGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~85°C TJ
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Stratix® III E
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
ECCN Code
3A001.A.7.A
Additional Feature
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
0.86V~1.15V
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

0.9V
Terminal Pitch
1mm
Base Part Number
EP3SE260
JESD-30 Code
S-PBGA-B1517
Number of Outputs

Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

976
Qualification Status
Not Qualified
Power Supplies
1.2/3.3V
Number of I/O
976
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

717MHz
Number of Inputs

The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

976
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
255000
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

16672768
Number of LABs/CLBs

Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

10200
Height Seated (Max)
3.9mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

40mm
Width
40mm
RoHS Status
RoHS Compliant
Description
The Stratix III FPGA family offers high-performance, low-power FPGAs with advanced architecture. It features Programmable Power Technology for optimized power consumption, Selectable Core Voltage, and silicon process optimizations.

Features
Logic elements: 48,000 to 338,000
Enhanced TriMatrix memory: 2,430 to 20,497 Kbits
High-speed DSP blocks: 9x9, 12x12, 18x18, and 36x36 multipliers, multiply-accumulate functions, FIR filters
I/O:GND:PWR ratio of 8:1:1
On-die and on-package decoupling
Programmable Power Technology
Optional configuration bit stream security
Automatic error detection circuitry

Applications
High-performance logic
Digital signal processing (DSP)
Embedded designs
Data-centric applications
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Clock Frequency
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Height Seated (Max)
    Length
    Width
    RoHS Status
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    View Compare
  • EP3SE260F1517C4N
    EP3SE260F1517C4N
    8 Weeks
    Surface Mount
    1517-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    Stratix® III E
    Active
    3 (168 Hours)
    3A001.A.7.A
    IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    0.86V~1.15V
    BOTTOM
    BALL
    0.9V
    1mm
    EP3SE260
    S-PBGA-B1517
    976
    Not Qualified
    1.2/3.3V
    976
    717MHz
    976
    FIELD PROGRAMMABLE GATE ARRAY
    255000
    16672768
    10200
    3.9mm
    40mm
    40mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
  • EP3C10M164I7N
    8 Weeks
    Surface Mount
    164-TFBGA
    YES
    -40°C~100°C TJ
    Tray
    Cyclone® III
    Active
    3 (168 Hours)
    EAR99
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    2.5V
    0.5mm
    EP3C10
    S-PBGA-B164
    106
    Not Qualified
    1.2/3.3V
    106
    -
    106
    FIELD PROGRAMMABLE GATE ARRAY
    10320
    423936
    645
    -
    -
    -
    RoHS Compliant
    e1
    164
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    260
    40
  • EP3C10E144I7N
    11 Weeks
    Surface Mount
    144-LQFP Exposed Pad
    YES
    -40°C~100°C TJ
    Tray
    Cyclone® III
    Active
    3 (168 Hours)
    EAR99
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    QUAD
    GULL WING
    1.2V
    0.5mm
    EP3C10
    R-PQFP-G144
    94
    Not Qualified
    -
    94
    472.5MHz
    94
    FIELD PROGRAMMABLE GATE ARRAY
    10320
    423936
    645
    1.6mm
    20mm
    20mm
    RoHS Compliant
    e3
    144
    Matte Tin (Sn)
    260
    40

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