Altera EPF10K30ATC144-2N

Mfr.Part #:

EPF10K30ATC144-2N

Manufacturer:

Description:
IC FPGA 102 I/O 144TQFP

RoHS Status:

RoHS

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Payment

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

144-LQFP
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~70°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

FLEX-10KA®
JESD-609 Code
e3
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
144
ECCN Code
3A991
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3.3V
Terminal Pitch
0.5mm
Reach Compliance Code
compliant
Reflow Temperature-Max (s)
40
Base Part Number
EPF10K30
JESD-30 Code
S-PQFP-G144
Number of Outputs

Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

102
Qualification Status
Not Qualified
Power Supplies
2.5/3.33.3V
Number of I/O
102
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

80MHz
Propagation Delay
0.7 ns
Number of Inputs

The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

102
Programmable Logic Type
LOADABLE PLD
Number of Logic Elements/Cells
1728
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

12288
Number of Gates
69000
Number of LABs/CLBs

Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

216
Output Function
REGISTERED
Number of Dedicated Inputs
4
Height Seated (Max)
1.6mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

20mm
Width
20mm
RoHS Status
RoHS Compliant
Description
The FLEX 10K and FLEX 10KA families are the industry's first embedded programmable logic devices (PLDs), providing System-on-a-Programmable-Chip (SOPC) integration. They feature an embedded array for implementing megafunctions, such as efficient memory and specialized logic functions, as well as a logic array for general logic functions.

Features
High density: 10,000 to 250,000 typical gates
Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity
MultiVolt I/O interface support:
5.0-V tolerant input pins in FLEX 10KA devices
Support for PCI Local Bus Specification, Revision 2.2
Pull-up clamping diode in FLEX 10KA devices for 3.3-V PCI compliance
Support for 5.0-V PCI buses with eight or fewer loads
Low power consumption: typical specification less than 0.5 mA in standby mode for most devices
Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic

Applications
The FLEX 10K and FLEX 10KA families are ideal for a wide range of applications, including:
System-on-a-chip (SoC) designs
Embedded control systems
Industrial automation
Telecommunications
Networking
Consumer electronics
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Clock Frequency
    Propagation Delay
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of Gates
    Number of LABs/CLBs
    Output Function
    Number of Dedicated Inputs
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Time@Peak Reflow Temperature-Max (s)
    Number of Logic Cells
    View Compare
  • EPF10K30ATC144-2N
    EPF10K30ATC144-2N
    Surface Mount
    144-LQFP
    YES
    0°C~70°C TA
    Tray
    FLEX-10KA®
    e3
    Obsolete
    3 (168 Hours)
    144
    3A991
    Matte Tin (Sn)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    3V~3.6V
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    compliant
    40
    EPF10K30
    S-PQFP-G144
    102
    Not Qualified
    2.5/3.33.3V
    102
    80MHz
    0.7 ns
    102
    LOADABLE PLD
    1728
    12288
    69000
    216
    REGISTERED
    4
    1.6mm
    20mm
    20mm
    RoHS Compliant
    -
    -
    -
  • EPF10K100EFC256-2X
    Surface Mount
    256-BGA
    YES
    0°C~70°C TA
    Tray
    FLEX-10KE®
    e0
    Obsolete
    3 (168 Hours)
    256
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    2.375V~2.625V
    BOTTOM
    BALL
    220
    2.5V
    1mm
    compliant
    -
    EPF10K100
    S-PBGA-B256
    191
    Not Qualified
    2.52.5/3.3V
    191
    -
    0.5 ns
    191
    LOADABLE PLD
    4992
    49152
    257000
    624
    MIXED
    -
    2.1mm
    17mm
    17mm
    Non-RoHS Compliant
    30
    -
  • EPF10K10ATC100-3N
    Surface Mount
    100-TQFP
    YES
    0°C~70°C TA
    Tray
    FLEX-10KA®
    e3
    Obsolete
    3 (168 Hours)
    100
    EAR99
    Matte Tin (Sn)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    3V~3.6V
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    compliant
    40
    EPF10K10
    S-PQFP-G100
    66
    Not Qualified
    2.5/3.33.3V
    66
    80MHz
    0.8 ns
    66
    LOADABLE PLD
    576
    6144
    31000
    72
    REGISTERED
    4
    1.27mm
    14mm
    14mm
    RoHS Compliant
    -
    576

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