XP Power ICH10024WS12

Mfr.Part #:

ICH10024WS12

Manufacturer:

Description:
DC/DC CONVERTER

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Factory Lead Time
12 Weeks
Mount
PCB, Through Hole
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Through Hole
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

9-DIP Module
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~100°C
Packaging
Box
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

ICH (200W)
Published
2013
Size / Dimension
2.40Lx2.28W x 0.50 H 61.0mmx57.9mmx12.7mm
Feature
Remote On/Off, OVP, SCP
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
9
ECCN Code
EAR99
Applications
ITE (Commercial)
Max Power Dissipation
100W
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

HYBRID
Terminal Position
DUAL
Terminal Form
PIN/PEG
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Depth
61mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
9
JESD-30 Code
R-MDMA-P9
Number of Outputs

Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

1
Efficiency
85%
Voltage - Isolation

Voltage - Isolation refers to the maximum voltage that can be applied between two points in an electronic component without causing electrical breakdown. It is a measure of the component's ability to withstand high voltages without allowing current to flow between the points. A higher voltage isolation rating indicates that the component can withstand higher voltages without failing.

1.5kV
Voltage - Input (Max)
36V
Output Voltage

Output Voltage is the voltage level produced by an electronic component when it is operating. It is typically measured in volts (V) and can be either positive or negative. The output voltage of a component is determined by its design and the input voltage applied to it. For example, a voltage regulator will produce a fixed output voltage regardless of the input voltage, while an amplifier will produce an output voltage that is proportional to the input voltage.

12V
Max Output Current
8.3A
Voltage - Output 1
12V
Input Voltage-Nom
24V
Trim/Adjustable Output
YES
Output Power

Output Power is a measure of the electrical power delivered by an electronic component to a load. It is typically expressed in watts (W) or milliwatts (mW). The output power of a component is determined by its design and the voltage and current applied to it. Output power is an important parameter for many electronic components, such as amplifiers, power supplies, and transmitters. It is used to determine the component's efficiency and to ensure that it can provide enough power to drive the load.

100W
Control Features
Enable, Active High
Current - Output 1
8.3A
Max Output Power
100W
Max Input Voltage (DC)
36V
Min Input Voltage (DC)
9V
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

12.7mm
Width
57.9mm
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
The ICH10024WS12 is DC/DC CONVERTER , it is part of ICH series. they are designed to work as DC DC Converters.ICH10024WS12 with pin details manufactured by XP Power. The ICH10024WS12 is available in Package,it is part of the electronic component Chips.that includes ICH Series. they are designed to operate as DC DC Converters.it is with Operating Temperature -40°C ~ 100°C.ICH10024WS12 with original stock manufactured by XP Power. The ICH10024WS12 is available in Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of ICH10024WS12is designed to work in 9-DIP Module, it's Operating Temperature is -40°C ~ 100°C.The ICH10024WS12 is available in 9-DIP Module Package, is part of the DC DC Converters and belong to Power Supplies - Board Mount.ICH10024WS12 with EDA / CAD Models manufactured by XP Power. The ICH10024WS12 is available in Package, is part of the Power Supplies - Board Mount.The ICH10024WS12 is DC DC Converters with package 9-DIP Module manufactured by XP Power. The ICH10024WS12 is available in Package, is part of the DC/DC CONVERTER.
ICH10024WS12 More Descriptions
DC-DC Converter, 100W, 4:1 INPUT | XP Power ICH10024WS12
Dc/Dc Converter, 100W, 12V, 8.3A; Power Supply Applications:Ite; Input Ratio:4:1; Output Power Max:100W; No. Of Outputs:1 Output; Output Voltage - Output 1:12V; Output Current - Output 1:8.3A; Output Voltage - Output 2:-; Depth:61Mm Rohs Compliant: Yes |Xp Power ICH10024WS12
DC-DC CONVERTER, 100W, 12V, 8.3A; No. of Outputs: 1 Output; Output Power Max: 100W; Output Voltage - Output 1: 12V; Output Current - Output 1: 8.3A; Output Voltage - Output 2: -; Output Current - Output 2: -; Output Voltage - Output 3: -; Output Current - Output 3: -; Product Range: ICH Series; Input Voltage DC Min: 9V; Input Voltage DC Max: 36V; DC / DC Converter Output Type: Fixed, Adjustable; DC / DC Converter Type: Half Brick; DC / DC Converter Mounting: Through Hole; Width: 57.9mm; Height: 12.7mm; Depth: 61mm; SVHC: No SVHC (15-Jan-2018)
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Published
    Size / Dimension
    Feature
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Applications
    Max Power Dissipation
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Depth
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Number of Outputs
    Efficiency
    Voltage - Isolation
    Voltage - Input (Max)
    Output Voltage
    Max Output Current
    Voltage - Output 1
    Input Voltage-Nom
    Trim/Adjustable Output
    Output Power
    Control Features
    Current - Output 1
    Max Output Power
    Max Input Voltage (DC)
    Min Input Voltage (DC)
    Height
    Width
    REACH SVHC
    RoHS Status
    View Compare
  • ICH10024WS12
    ICH10024WS12
    12 Weeks
    PCB, Through Hole
    Through Hole
    9-DIP Module
    -40°C~100°C
    Box
    ICH (200W)
    2013
    2.40Lx2.28W x 0.50 H 61.0mmx57.9mmx12.7mm
    Remote On/Off, OVP, SCP
    Active
    1 (Unlimited)
    9
    EAR99
    ITE (Commercial)
    100W
    HYBRID
    DUAL
    PIN/PEG
    NOT SPECIFIED
    1
    61mm
    NOT SPECIFIED
    9
    R-MDMA-P9
    1
    85%
    1.5kV
    36V
    12V
    8.3A
    12V
    24V
    YES
    100W
    Enable, Active High
    8.3A
    100W
    36V
    9V
    12.7mm
    57.9mm
    Unknown
    ROHS3 Compliant
    -
  • ICH10048WS12
    12 Weeks
    PCB, Through Hole
    Through Hole
    9-DIP Module
    -40°C~100°C
    Box
    ICH (200W)
    2013
    2.40Lx2.28W x 0.50 H 61.0mmx57.9mmx12.7mm
    Remote On/Off, OVP, SCP
    Active
    1 (Unlimited)
    9
    EAR99
    ITE (Commercial)
    100W
    HYBRID
    DUAL
    PIN/PEG
    NOT SPECIFIED
    1
    61mm
    NOT SPECIFIED
    9
    R-MDMA-P9
    1
    86%
    1.5kV
    75V
    12V
    8.3A
    12V
    48V
    YES
    100W
    Enable, Active High
    8.3A
    100W
    75V
    18V
    12.7mm
    57.9mm
    Unknown
    ROHS3 Compliant
  • ICH10024WS05
    12 Weeks
    PCB, Through Hole
    Through Hole
    9-DIP Module
    -40°C~100°C
    Box
    ICH (200W)
    2013
    2.40Lx2.28W x 0.50 H 61.0mmx57.9mmx12.7mm
    Remote On/Off, OVP, SCP
    Active
    1 (Unlimited)
    9
    EAR99
    ITE (Commercial)
    100W
    HYBRID
    DUAL
    PIN/PEG
    NOT SPECIFIED
    1
    61mm
    NOT SPECIFIED
    9
    R-MDMA-P9
    1
    83%
    1.5kV
    36V
    5V
    20A
    5V
    24V
    YES
    100W
    Enable, Active High
    20A
    100W
    36V
    9V
    12.7mm
    57.9mm
    Unknown
    ROHS3 Compliant

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