Crouzet IMC3281.5M12

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Termination Style refers to the method used to connect an electronic component to a circuit board or other components. It describes the physical form and electrical characteristics of the connection point. Common termination styles include through-hole, surface mount, and press-fit. Through-hole components have leads that are inserted into holes on the circuit board and soldered in place. Surface mount components are soldered directly onto the surface of the circuit board. Press-fit components are inserted into holes on the circuit board and held in place by friction.

Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

Sensing Distance is the distance between an electronic component and an object when the component can detect the object's presence. It is typically measured in millimeters or inches. The sensing distance is determined by the component's design and the sensitivity of its sensor. A component with a longer sensing distance can detect objects from further away, while a component with a shorter sensing distance can detect objects that are closer.

Sensor Type refers to the physical principle or mechanism used by a sensor to detect and measure a specific physical quantity or phenomenon. It indicates the underlying technology or method employed by the sensor to convert the measured quantity into an electrical signal.