Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
PG-TO262-3
FET Type
FET Type refers to the specific type of Field-Effect Transistor (FET) used in an electronic circuit. FETs are semiconductor devices that control the flow of current using an electric field.
N Channel
Rds On (Max) @ Id, Vgs
2.1mΩ @ 100A,10V
Vgs(th) (Max) @ Id
4V @ 110uA
Drain to Source Voltage (Vdss)
40V
Continuous Drain Current (Id) @ 25°C
120A
Power Dissipation-Max (Ta=25°C)
158W
RoHS Status
RoHS Compliant
IPI120N04S4-02 Overview
This product is manufactured by INF and belongs to the category of Housingless Welding Diode. The images we provide are for reference only, for detailed product information please see specification sheet IPI120N04S4-02 or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of IPI120N04S4-02. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
