Intersil ISL84684IRZ

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

A multiplexer (MUX) combines multiple input signals into a single output signal, while a demultiplexer (DEMUX) does the reverse, splitting a single input signal into multiple output signals. These circuits are used in various applications, such as data transmission, signal processing, and communication systems. Multiplexers allow for efficient use of transmission channels by combining multiple signals into a single stream, while demultiplexers enable the separation of signals that have been combined.

Switch Circuit is an electronic component parameter that refers to the electrical circuit that controls the switching action of a switch. It includes the components and connections that determine the conditions under which the switch opens or closes, such as the type of switch, the voltage or current applied, and any additional circuitry for logic or protection. The switch circuit ensures that the switch operates reliably and efficiently within the intended application.

Crosstalk is an electronic component parameter that measures the unwanted transfer of energy from one circuit or channel to another. It is typically expressed in decibels (dB) and is a measure of the amount of interference that one signal causes on another. Crosstalk can be caused by a variety of factors, including capacitive coupling, inductive coupling, and electromagnetic interference. It can be a significant problem in high-speed electronic circuits, where it can cause errors and reduce the overall performance of the system.