Microsemi Corporation JAN1N2808B

Mfr.Part #:

JAN1N2808B

Manufacturer:

Description:
DIODE ZENER 10V 50W TO204AD

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mount
Through Hole
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Through Hole
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

TO-204AD
Diode Element Material
SILICON
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-65°C~175°C
Packaging
Bulk
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Military, MIL-PRF-19500/114
Published
1999
Tolerance

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

±5%
JESD-609 Code
e0
Pbfree Code
no
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
HTS Code
8541.10.00.50
Max Power Dissipation
50W
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

ZENER
Terminal Position
BOTTOM
Terminal Form
PIN/PEG
Pin Count
2
Reference Standard
MIL-19500/114
JESD-30 Code
O-MBFM-P2
Qualification Status
Qualified
Number of Elements
1
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

UNIDIRECTIONAL
Element Configuration
Single
Diode Type

Diode Type refers to the specific type of diode used in an electronic circuit. Diodes are semiconductor devices that allow current to flow in only one direction. Different types of diodes have different characteristics and applications.

ZENER DIODE
Current - Reverse Leakage @ Vr
25μA @ 6.7V
Power Dissipation

Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

50W
Voltage - Forward (Vf) (Max) @ If
1.5V @ 10A
Max Reverse Leakage Current
25μA
Impedance-Max
0.6Ohm
Test Current
1.2A
Reference Voltage
10V
Zener Voltage
10V
Voltage Tol-Max
5%
Voltage Tolerance
5%
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
JAN1N2808B Overview
This electrical device requires reverse leakage current of 25μA @ 6.7V.Tol is the maximum voltage that can be supplied (5%).Reverse leakage current reaches 25μA at its maximum.Zener single diode reaches 1.5V @ 10A when Zener single diode is supplied wZener single diodeh the maximum voltage - Forward (Vf).

JAN1N2808B Features
reverse leakage current of 25μA @ 6.7V
25μA @ 6.7V is the maximum voltage (Tol)
Reverse leakage current reaches 25μA


JAN1N2808B Applications
There are a lot of Microsemi Corporation
JAN1N2808B applications of zener single diodes.



JAN1N2808B More Descriptions
Diode Zener Single 10V 5% 50W 2-Pin TO-3 Tray
Voltage Regulator _ TO-3
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Mount
    Mounting Type
    Package / Case
    Diode Element Material
    Operating Temperature
    Packaging
    Series
    Published
    Tolerance
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Max Power Dissipation
    Technology
    Terminal Position
    Terminal Form
    Pin Count
    Reference Standard
    JESD-30 Code
    Qualification Status
    Number of Elements
    Polarity
    Element Configuration
    Diode Type
    Current - Reverse Leakage @ Vr
    Power Dissipation
    Voltage - Forward (Vf) (Max) @ If
    Max Reverse Leakage Current
    Impedance-Max
    Test Current
    Reference Voltage
    Zener Voltage
    Voltage Tol-Max
    Voltage Tolerance
    Radiation Hardening
    RoHS Status
    Number of Pins
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Impedance
    Power - Max
    Voltage - Zener (Nom) (Vz)
    View Compare
  • JAN1N2808B
    JAN1N2808B
    IN PRODUCTION (Last Updated: 1 month ago)
    Through Hole
    Through Hole
    TO-204AD
    SILICON
    -65°C~175°C
    Bulk
    Military, MIL-PRF-19500/114
    1999
    ±5%
    e0
    no
    Active
    1 (Unlimited)
    2
    EAR99
    Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
    8541.10.00.50
    50W
    ZENER
    BOTTOM
    PIN/PEG
    2
    MIL-19500/114
    O-MBFM-P2
    Qualified
    1
    UNIDIRECTIONAL
    Single
    ZENER DIODE
    25μA @ 6.7V
    50W
    1.5V @ 10A
    25μA
    0.6Ohm
    1.2A
    10V
    10V
    5%
    5%
    No
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • JAN1N2991B
    IN PRODUCTION (Last Updated: 1 month ago)
    Stud
    Stud Mount
    DO-203AA, DO-4, Stud
    SILICON
    -65°C~175°C
    Bulk
    Military, MIL-PRF-19500/124
    1999
    ±5%
    e0
    no
    Active
    1 (Unlimited)
    1
    EAR99
    Tin/Lead (Sn/Pb)
    8541.10.00.50
    10W
    ZENER
    UPPER
    SOLDER LUG
    1
    -
    O-MUPM-D1
    Qualified
    1
    UNIDIRECTIONAL
    Single
    ZENER DIODE
    10μA @ 27.4V
    10W
    1.5V @ 2A
    10μA
    10Ohm
    70mA
    36V
    36V
    5%
    5%
    No
    Non-RoHS Compliant
    2
    -
    -
    -
    -
    -
    -
  • JAN1N2821RB
    IN PRODUCTION (Last Updated: 6 months ago)
    Through Hole
    Through Hole
    TO-204AD
    -
    -65°C~175°C
    Bulk
    Military, MIL-PRF-19500/114
    -
    ±5%
    -
    -
    Active
    1 (Unlimited)
    -
    -
    -
    -
    5W
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    10μA @ 19V
    -
    1.5V @ 10A
    -
    2.7Ohms
    -
    -
    25V
    -
    -
    -
    Non-RoHS Compliant
    -
    TO-204AD (TO-3)
    175°C
    -65°C
    2.7Ohm
    5W
    25V

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