TOKO LL1608-FS18NJ

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Inductance is a property of an electrical conductor that opposes changes in current flow. It is measured in henrys (H) and is represented by the symbol L. Inductance is caused by the magnetic field generated by the current flowing through the conductor. When the current changes, the magnetic field also changes, which induces an electromotive force (EMF) in the conductor. This EMF opposes the change in current flow.