Microsemi Corporation M2GL005S-1VFG256

Mfr.Part #:

M2GL005S-1VFG256

Manufacturer:

Description:
IC FPGA 161 I/O 256VFBGA

RoHS Status:

RoHS

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Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Factory Lead Time
10 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

256-LFBGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~85°C TJ
Packaging
Tray
Published
2015
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

IGLOO2
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
256
HTS Code
8542.39.00.01
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

1.2V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B256
Number of I/O
161
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
6060
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

719872
Height Seated (Max)
1.56mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

14mm
Width
14mm
RoHS Status
RoHS Compliant
M2GL005S-1VFG256 Overview
The product is currently in production and was last updated one month ago. It has a surface mount mounting type and a 256-LFBGA package/case. The series is IGLOO2. It has a moisture sensitivity level of 3, meaning it can withstand 168 hours of exposure to moisture. It has 256 terminations and the terminal position is on the bottom. The terminal pitch is 0.8mm. The JESD-30 Code is S-PBGA-B256. It is a field programmable gate array, meaning it can be programmed by the user for specific applications.

M2GL005S-1VFG256 Features
161 I/Os
Up to 719872 RAM bits

M2GL005S-1VFG256 Applications
There are a lot of Microsemi Corporation M2GL005S-1VFG256 FPGAs applications.

Industrial,Medical and Scientific Instruments
Software-defined radios
Automotive
Camera time adjustments
Solar Energy
Space Applications
Automotive driver's assistance
Data center hardware accelerators
Cryptography
Secure Communication
M2GL005S-1VFG256 More Descriptions
M2Gl005S-1Vfg256 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2GL005S-1VFG256
IGLOO2 Low Density FPGA, 6KLEs
IC FPGA 161 I/O 256VFBGA
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of I/O
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Subcategory
    Technology
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of Inputs
    View Compare
  • M2GL005S-1VFG256
    M2GL005S-1VFG256
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    256-LFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    256
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    0.8mm
    30
    S-PBGA-B256
    161
    FIELD PROGRAMMABLE GATE ARRAY
    6060
    719872
    1.56mm
    14mm
    14mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • M2GL060T-FCSG325I
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    -
    30
    S-PBGA-B325
    200
    FIELD PROGRAMMABLE GATE ARRAY
    56520
    1869824
    -
    -
    -
    RoHS Compliant
    -
    -
    -
    -
    -
    -
  • M2GL025T-1FCSG325I
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    -
    30
    S-PBGA-B325
    180
    FIELD PROGRAMMABLE GATE ARRAY
    27696
    1130496
    -
    -
    -
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    180
    Not Qualified
    1.2V
    180

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