Factory Lead Time
10 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
256-LFBGA
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~85°C TJ
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
IGLOO2
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
256
Voltage - Supply
1.14V~2.625V
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
1.2V
Reflow Temperature-Max (s)
30
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
6060
Total RAM Bits
Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.
719872
Height Seated (Max)
1.56mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
14mm
RoHS Status
RoHS Compliant
M2GL005S-1VFG256 Overview
The product is currently in production and was last updated one month ago. It has a surface mount mounting type and a 256-LFBGA package/case. The series is IGLOO2. It has a moisture sensitivity level of 3, meaning it can withstand 168 hours of exposure to moisture. It has 256 terminations and the terminal position is on the bottom. The terminal pitch is 0.8mm. The JESD-30 Code is S-PBGA-B256. It is a field programmable gate array, meaning it can be programmed by the user for specific applications.
M2GL005S-1VFG256 Features
161 I/Os
Up to 719872 RAM bits
M2GL005S-1VFG256 Applications
There are a lot of Microsemi Corporation M2GL005S-1VFG256 FPGAs applications.
Industrial,Medical and Scientific Instruments
Software-defined radios
Automotive
Camera time adjustments
Solar Energy
Space Applications
Automotive driver's assistance
Data center hardware accelerators
Cryptography
Secure Communication
M2GL005S-1VFG256 More Descriptions
M2Gl005S-1Vfg256 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2GL005S-1VFG256
IGLOO2 Low Density FPGA, 6KLEs
IC FPGA 161 I/O 256VFBGA