Microsemi Corporation M2GL005S-VFG400

Mfr.Part #:

M2GL005S-VFG400

Manufacturer:

Description:
IC FPGA 169 I/O 400VFBGA

RoHS Status:

RoHS

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Payment

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Specifications

Product Details

Product Comparison

Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time
10 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

400-LFBGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~85°C TJ
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

IGLOO2
Published
2015
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
400
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

1.2V
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B400
Number of Outputs

Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

171
Qualification Status
Not Qualified
Power Supplies
1.2V
Number of I/O
169
Number of Inputs

The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

171
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
6060
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

719872
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

17mm
Height Seated (Max)
1.51mm
Width
17mm
RoHS Status
RoHS Compliant
M2GL005S-VFG400 Overview
This package is included in the 400-LFBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.14V~2.625V . An FPGA belonging to the IGLOO2 series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 171 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 400. This device is equipped with 719872 RAM bits in terms of its RAM si719872e. It is powered by a 1.2V battery, which can be purchased separately.

M2GL005S-VFG400 Features
169 I/Os
Up to 719872 RAM bits


M2GL005S-VFG400 Applications
There are a lot of Microsemi Corporation
M2GL005S-VFG400 FPGAs applications.


ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
M2GL005S-VFG400 More Descriptions
M2Gl005S-Vfg400 400 Lfbga 17X17X1.51Mm Tray Rohs Compliant: Yes |Microchip M2GL005S-VFG400
IGLOO2 Low Density FPGA, 6KLEs
IC FPGA 169 I/O 400VFBGA
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Reflow Temperature-Max (s)
    Base Part Number
    RAM Size
    View Compare
  • M2GL005S-VFG400
    M2GL005S-VFG400
    IN PRODUCTION (Last Updated: 1 month ago)
    10 Weeks
    Surface Mount
    400-LFBGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    400
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    0.8mm
    30
    S-PBGA-B400
    171
    Not Qualified
    1.2V
    169
    171
    FIELD PROGRAMMABLE GATE ARRAY
    6060
    719872
    17mm
    1.51mm
    17mm
    RoHS Compliant
    -
    -
    -
    -
  • M2GL150-1FCG1152
    IN PRODUCTION (Last Updated: 3 weeks ago)
    12 Weeks
    Surface Mount
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    2013
    Active
    3 (168 Hours)
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    -
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    -
    S-PBGA-B1152
    574
    Not Qualified
    1.2V
    574
    574
    FIELD PROGRAMMABLE GATE ARRAY
    146124
    5120000
    35mm
    2.9mm
    35mm
    RoHS Compliant
    30
    M2GL150
    625kB
  • M2GL050TS-FG484
    IN PRODUCTION (Last Updated: 1 month ago)
    12 Weeks
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    484
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    20
    S-PBGA-B484
    267
    Not Qualified
    1.2V
    267
    267
    FIELD PROGRAMMABLE GATE ARRAY
    56340
    1869824
    23mm
    2.44mm
    23mm
    Non-RoHS Compliant
    -
    -
    -

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