Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Through Hole
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
16-DIP (0.300, 7.62mm)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
16
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C~125°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
74HC
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
16
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
4.5V
Base Part Number
M74HC133
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
Voltage
Supply Voltage-Max (Vsup)
6V
Supply Voltage-Min (Vsup)
2V
Load Capacitance
Load Capacitance (CL) is a parameter that specifies the maximum capacitance that can be connected to the output of an electronic component without affecting its performance. It is typically measured in picofarads (pF) or nanofarads (nF). A high load capacitance can cause the output voltage to drop or the output current to increase, which can lead to instability or damage to the component.
50pF
Power Dissipation
Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.
500mW
Output Current
Output Current is the maximum amount of current that an electronic component can deliver to a load without exceeding its specified operating limits. It is typically measured in amperes (A) or milliamperes (mA). Output Current is a critical parameter for selecting electronic components, as it determines the amount of power that the component can provide to a load.
5.2mA
Quiescent Current
Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.
1μA
Number of Inputs
The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.
13
Current - Output High, Low
5.2mA 5.2mA
Logic Type
Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.
NAND Gate
Max Propagation Delay @ V, Max CL
22ns @ 6V, 50pF
Logic Level - Low
0.5V ~ 1.8V
Logic Level - High
Logic Level - High refers to the voltage level that represents a logical "1" in a digital circuit. It is typically defined as a voltage range that is higher than a specified threshold voltage. The specific value of the Logic Level - High depends on the logic family being used, such as TTL, CMOS, or ECL. For example, in TTL logic, the Logic Level - High is typically defined as a voltage between 2.4V and 5V.
1.5V ~ 4.2V
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
4.59mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
20mm
RoHS Status
ROHS3 Compliant
Description
The M74HC133 is a high-speed CMOS 13-input NAND gate fabricated with silicon-gate CMOS technology. The internal circuit consists of 7 stages, including a buffer output, providing high noise immunity and stable output.
Features
High speed: Propagation delay of 14 ns (typical) at Vcc = 6V
Low power dissipation: Icc = 1 μA (max) at TA = 25°C
High noise immunity: VNIH, VNIL = 28% Vcc (min)
Symmetrical output impedance: IOH, IOL = 4 mA (min)
Balanced propagation delays: PLH, PHL
Wide operating voltage range: Vcc (OPR) 2V to 6V
Pin and function compatible with 74 series 133
Applications
Logic functions
Data processing
Signal conditioning
Interfacing
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Image
Part Number
Manufacturer
Mount
Mounting Type
Package / Case
Number of Pins
Weight
Operating Temperature
Packaging
Series
JESD-609 Code
Pbfree Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
Terminal Finish
Subcategory
Technology
Voltage - Supply
Terminal Position
Number of Functions
Supply Voltage
Terminal Pitch
Base Part Number
Pin Count
Output Type
Supply Voltage-Max (Vsup)
Power Supplies
Supply Voltage-Min (Vsup)
Load Capacitance
Power Dissipation
Output Current
Propagation Delay
Quiescent Current
Turn On Delay Time
Family
Logic Function
Number of Inputs
Current - Output High, Low
Logic Type
Max I(ol)
Number of Gates
Max Propagation Delay @ V, Max CL
Schmitt Trigger
Logic Level - Low
Logic Level - High
Height
Length
Width
Radiation Hardening
REACH SVHC
RoHS Status
Lead Free
Feature
Packing Method
Terminal Form
Peak Reflow Temperature (Cel)
Reflow Temperature-Max (s)
Number of Outputs
Schmitt Trigger Input
View Compare
-
M74HC133B1R
PCB, Through Hole
Through Hole
16-DIP (0.300, 7.62mm)
16
4.535924g
-55°C~125°C
Tube
74HC
e4
yes
Obsolete
1 (Unlimited)
16
Nickel/Palladium/Gold (Ni/Pd/Au)
Gates
CMOS
2V~6V
DUAL
1
4.5V
2.54mm
M74HC133
16
Voltage
6V
2/6V
2V
50pF
500mW
5.2mA
130 ns
1μA
33 ns
HC/UH
NAND
13
5.2mA 5.2mA
NAND Gate
0.004 A
1
22ns @ 6V, 50pF
NO
0.5V ~ 1.8V
1.5V ~ 4.2V
4.59mm
20mm
7.1mm
No
No SVHC
ROHS3 Compliant
Lead Free
-
-
-
-
-
-
-
-
-
Surface Mount
Surface Mount
14-SOIC (0.154, 3.90mm Width)
14
-
-55°C~125°C
Tape & Reel (TR)
74HC
e4
-
Obsolete
1 (Unlimited)
14
Nickel/Palladium/Gold (Ni/Pd/Au)
Gates
CMOS
2V~6V
DUAL
4
4.5V
-
M74HC132
14
-
6V
-
2V
50pF
-
5.2mA
18 ns
1μA
105 ns
HC/UH
NAND
2
5.2mA 5.2mA
NAND Gate
-
4
18ns @ 6V, 50pF
-
0.3V ~ 1.5V
1.5V ~ 4.2V
1.65mm
8.75mm
4mm
No
-
ROHS3 Compliant
Lead Free
Schmitt Trigger
TAPE AND REEL
GULL WING
260
40
1
Yes
-
Through Hole
Through Hole
14-DIP (0.300, 7.62mm)
14
4.535924g
-55°C~125°C
Tube
74HC
e4
yes
Obsolete
1 (Unlimited)
14
Nickel/Palladium/Gold (Ni/Pd/Au)
Gates
CMOS
2V~6V
DUAL
4
4.5V
-
M74HC00
14
-
6V
-
2V
50pF
-
5.2mA
19 ns
1μA
19 ns
HC/UH
NAND
2
5.2mA 5.2mA
NAND Gate
-
4
13ns @ 6V, 50pF
NO
0.5V ~ 1.8V
1.5V ~ 4.2V
6.35mm
2.54mm
6.35mm
No
No SVHC
ROHS3 Compliant
Lead Free
-
-
-
-
-
1
-