Vishay Semiconductor Diodes Division MBL106S-M3/I

Mfr.Part #:

MBL106S-M3/I
Description:
RECT BRIDGE 1A 600V MBLS

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
14 Weeks
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

4-SMD, Gull Wing
Weight
135.992662mg
Diode Element Material
SILICON
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2016
JESD-609 Code
e3
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
4
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
UL RECOGNIZED
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

Standard
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-G4
Number of Elements
4
Configuration
BRIDGE, 4 ELEMENTS
Diode Type

Diode Type refers to the specific type of diode used in an electronic circuit. Diodes are semiconductor devices that allow current to flow in only one direction. Different types of diodes have different characteristics and applications.

Single Phase
Current - Reverse Leakage @ Vr
5μA @ 600V
Voltage - Forward (Vf) (Max) @ If
950mV @ 400mA
Max Surge Current
30A
Output Current-Max
1A
Current - Average Rectified (Io)
1A
Number of Phases
1
Voltage - Peak Reverse (Max)
600V
Breakdown Voltage-Min
600V
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

1.5mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

5.3mm
Width
4.6mm
RoHS Status
ROHS3 Compliant
MBL106S-M3/I Overview
Basically, it's an electronic component that comes in a 4-SMD, Gull Wing package.This device is mounted in the Surface Mount position.Keeping it at -55°C~150°C TJ ensures its normal operation.There is a maximum output voltage of 1A that it can support.A surge current should not exceed 30A and should be monitored.

MBL106S-M3/I Features
4-SMD, Gull Wing package
operating at a temperature of -55°C~150°C TJ
the maximum output voltage of 1A


MBL106S-M3/I Applications
There are a lot of Vishay Semiconductor Diodes Division
MBL106S-M3/I applications of bridge rectifiers.


Military and other high-reliability applications
High forward surge current capability
Low thermal resistance
Extremely robust construction
Fuse-in-glass diodes design
Electrically isolated aluminum case
Motor controls – Low Voltage and Medium Voltage converters
SCR power bridges for solid state starters
SCR and diode based input rectifiers
Crowbar systems for motor drives
MBL106S-M3/I More Descriptions
Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier
1A/600V Surface mount Bridge Rectifier
French Electronic Distributor since 1988
BRIDGE RECT 1PHASE 600V 1A 4SMD
No Product Comparison

Recommended Offers

Microchip Technology
PIC16LC773/SO
Microchip Technology
PIC16LF1559-E/P
Infineon Technologies
AUIRS2302S
Infineon Technologies
TDA21106
Cypress Semiconductor Corp
S29GL01GP12FAI010
Texas Instruments
PDRV8305NEPHPRQ1
Infineon Technologies
AUIRS2124S
Microchip Technology
TC7106ACPL
Micron Technology Inc.
MT49H32M18FM-33:B
Maxim Integrated
MAX620EPN
Infineon Technologies
IRS2334SPBF
Microchip Technology
TC1413CPA