IXYS Integrated Circuits Division MX868R

Mfr.Part #:

MX868R
Description:
SENSOR LINEAR SPI 8DFN

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Factory Lead Time
25 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

8-VDFN Exposed Pad
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

8
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tube
Published
2008
Feature
Programmable
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Discontinued
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

Hall Effect
Voltage - Supply
4.5V~5.5V
Body Length or Diameter
4mm
Body Breadth
4 mm
Output Type

Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

SPI
Termination Type
SOLDER
Operating Supply Current

Operating Supply Current is the amount of current drawn by an electronic component when it is operating under normal conditions. It is typically measured in milliamps (mA) or microamps (µA). The operating supply current is important because it can affect the power consumption of the component and the overall system. A higher operating supply current will result in higher power consumption, which can lead to overheating and reduced battery life.

3mA
Resolution
12 b
Sensing Range
±20mT
Axis
Single
Magnetic Field Range-Min
-10 mT
Output Interface Type
3-WIRE INTERFACE
Magnetic Field Range-Max
10 mT
RoHS Status
ROHS3 Compliant
MX868R Overview
This product is manufactured by IXYS Integrated Circuits Division and belongs to the category of Magnetic Sensors - Linear, Compass (ICs). The images we provide are for reference only, for detailed product information please see specification sheet MX868R or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of MX868R. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
MX868R More Descriptions
SENSOR HALL EFFECT SPI 8DFN
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Feature
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Body Length or Diameter
    Body Breadth
    Output Type
    Termination Type
    Operating Supply Current
    Resolution
    Sensing Range
    Axis
    Magnetic Field Range-Min
    Output Interface Type
    Magnetic Field Range-Max
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Current - Supply (Max)
    Max Supply Current
    Sensing Method
    Body Height
    View Compare
  • MX868R
    MX868R
    25 Weeks
    Surface Mount
    8-VDFN Exposed Pad
    YES
    8
    -40°C~85°C TA
    Tube
    2008
    Programmable
    yes
    Discontinued
    1 (Unlimited)
    Hall Effect
    4.5V~5.5V
    4mm
    4 mm
    SPI
    SOLDER
    3mA
    12 b
    ±20mT
    Single
    -10 mT
    3-WIRE INTERFACE
    10 mT
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • MX8682RTR
    25 Weeks
    Surface Mount
    8-VDFN Exposed Pad
    -
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2008
    Programmable
    -
    Discontinued
    1 (Unlimited)
    Hall Effect
    4.5V~5.5V
    -
    -
    SPI
    -
    -
    12 b
    ±20mT
    Single
    -
    -
    -
    ROHS3 Compliant
    8-DFN (4x5)
    85°C
    -40°C
    3mA
    3mA
    Hall Effect
    -
  • MX868RTR
    25 Weeks
    Surface Mount
    8-VDFN Exposed Pad
    YES
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2008
    Programmable
    yes
    Discontinued
    1 (Unlimited)
    Hall Effect
    4.5V~5.5V
    4mm
    4 mm
    SPI
    SOLDER
    -
    12 b
    ±20mT
    Single
    -10 mT
    3-WIRE INTERFACE
    10 mT
    ROHS3 Compliant
    -
    -
    -
    -
    3mA
    Hall Effect
    0.85mm

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