Microchip Technology PIC16F1776T-I/SS

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PIC16F1776T-I/SS

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Description:
IC MCU 8BIT 14KB FLASH 28SSOP

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RoHS

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Total Price: $2.56

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ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
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ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
9 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

28-SSOP (0.209, 5.30mm Width)
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

PIC® XLP™ 16F
Published
2016
JESD-609 Code
e3
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
28
Terminal Finish
Matte Tin (Sn) - annealed
Additional Feature
ALSO OPERATES WITH 2.3V MIN@16 MHZ
HTS Code
8542.31.00.01
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3V
Terminal Pitch
0.65mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

32MHz
Base Part Number
PIC16F1776
JESD-30 Code
R-PDSO-G28
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
2.5V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

I2C, LIN, SPI, UART, USART
Memory Size
14kB
Oscillator Type
Internal
Number of I/O
25
RAM Size
1K x 8
Voltage - Supply (Vcc/Vdd)
2.3V~5.5V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

PIC
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type
FLASH
Core Size

Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

8-Bit
Program Memory Size
14KB 8K x 14
Connectivity

Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

I2C, LINbus, SPI, UART/USART
Bit Size
8
Data Converter
A/D 17x10b; D/A 3x5b, 3x10b
Has ADC
YES
DMA Channels
NO
PWM Channels
YES
DAC Channels
YES
EEPROM Size
128 x 8
On Chip Program ROM Width
14
Screening Level
TS 16949
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

10.2mm
Height Seated (Max)
2mm
Width
5.3mm
RoHS Status
ROHS3 Compliant
Description
PIC16(L)F177X microcontrollers integrate intelligent analog and digital peripherals for applications such as lighting, power supplies, battery charging, and motor control. They feature multiple op amps, DACs, comparators, ADCs, PWMs, PRGs, and other peripherals that can be internally connected to create closed-loop systems. The PPS functionality allows flexible peripheral pin mapping.

Features
C Compiler Optimized RISC Architecture
Operating Speed: DC-32 MHz clock input, 125 ns minimum instruction cycle
Interrupt Capability: 16-Level Deep Hardware Stack
Five 8-Bit Timers, Three 16-Bit Timers
Low-Current Power-on Reset (POR), Configurable Power-up Timer (PWRT)
Brown-out Reset (BOR) with Selectable Trip Point
Extend Watchdog Timer (EWDT): Low-power 31 kHz WDT, Software selectable pre-scaler and enable
Memory: Up to 28 Kbytes Program Flash Memory (PFM), Up to 2 Kbytes Data RAM, Direct, Indirect and Relative Addressing modes, High-Endurance Flash (HEF): 128B of nonvolatile data storage, 100K Erase/Write cycles
Operating Characteristics: Operating Voltage Range: 1.8V to 3.6V (PIC16LF1773/6/7/8/9), 2.3V to 5.5V (PIC16F1773/6/7/8/9), Temperature Range: Industrial: -40°C to 85°C, Extended: -40°C to 125°C
eXtreme Low-Power (XLP) Features: Sleep mode: 50 nA @ 1.8V, typical, Watchdog Timer: 500 nA @ 1.8V, typical, Secondary Oscillator: 500 nA @ 32 kHz, Operating Current: 8 uA @ 31 kHz, 1.8V, typical, 32 UA/MHz 1.8V, typical

Applications
Lighting
Power supplies
Battery charging
Motor control
General purpose applications
No Product Comparison

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