Vgs(th) (Max) @ Id:
4V @ 250µA
Technology:
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
MOSFET (Metal Oxide)
Supplier Device Package:
TO-252AA
Series:
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
-
Rds On (Max) @ Id, Vgs:
47 mOhm @ 16A, 10V
Power Dissipation (Max):
72W (Tc)
Package / Case:
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
TO-252-3, DPak (2 Leads Tab), SC-63
Other Names:
RFD16N05SM9ACT
Operating Temperature:
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C ~ 175°C (TJ)
Mounting Type:
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Moisture Sensitivity Level (MSL):
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Manufacturer Standard Lead Time:
6 Weeks
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds:
900pF @ 25V
Gate Charge (Qg) (Max) @ Vgs:
80nC @ 20V
FET Type:
FET Type refers to the specific type of Field-Effect Transistor (FET) used in an electronic circuit. FETs are semiconductor devices that control the flow of current using an electric field.
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Drain to Source Voltage (Vdss):
50V
Detailed Description:
N-Channel 50V 16A (Tc) 72W (Tc) Surface Mount TO-252AA
Current - Continuous Drain (Id) @ 25°C:
16A (Tc)
The RFD16N05SM9A is , it is part of - series. they are designed to work as Housingless Welding Diode.RFD16N05SM9A with pin details manufactured by . The RFD16N05SM9A is available in TO-252AA Package,it is part of the electronic component Chips.that includes - Series. they are designed to operate as Housingless Welding Diode.it is with Operating Temperature -55°C ~ 175°C (TJ).RFD16N05SM9A with original stock manufactured by . The RFD16N05SM9A is available in TO-252AA Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of RFD16N05SM9Ais designed to work in TO-252-3, DPak (2 Leads Tab), SC-63, it's Operating Temperature is -55°C ~ 175°C (TJ).The RFD16N05SM9A is available in TO-252-3, DPak (2 Leads Tab), SC-63 Package, is part of the Housingless Welding Diode and belong to RF Semiconductors.RFD16N05SM9A with EDA / CAD Models manufactured by . The RFD16N05SM9A is available in TO-252AAPackage, is part of the RF Semiconductors.The RFD16N05SM9A is Housingless Welding Diode with package TO-252-3, DPak (2 Leads Tab), SC-63 manufactured by . The RFD16N05SM9A is available in TO-252AA Package, is part of the .
RFD16N05SM9A More Descriptions
N-Channel 50 V 0.047 Ohm Surface Mount Power Mosfet - TO-252AA
N-Channel Power MOSFET 50V, 16A, 47mΩ
Power Field-Effect Transistor, 16A I(D), 50V, 0.047ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA
The RFD16N05 and RFD16N05SM N-channel power MOSFETs are manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI integrated circuits, gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors can be operated directly from integrated circuits. Formerly developmental type TA09771.
