Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
SMD
Brand
Brand refers to the manufacturer or company that produces the electronic component. It indicates the origin and quality of the component. Different brands may have varying levels of reputation, reliability, and specialization in specific types of components. Choosing components from reputable brands can provide assurance of quality, performance, and support.
Chilisin
SDT0402T-3R3M-N Overview
This product is manufactured by Chilisin and belongs to the category of obsolete (EOL) components. The images we provide are for reference only, for detailed product information please see specification sheet SDT0402T-3R3M-N or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of SDT0402T-3R3M-N. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
-
Image
Part Number
Manufacturer
Package / Case
Brand
View Compare
-
SDT0402T-3R3M-N
Chilisin
SMD
Chilisin
-
-
Chilisin
SMD
Chilisin
-
Chilisin
SMD
Chilisin
