Vgs(th) (Max) @ Id:
5V @ 250µA
Technology:
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
MOSFET (Metal Oxide)
Supplier Device Package:
TO-247-3
Series:
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
FDmesh™ II
Rds On (Max) @ Id, Vgs:
180 mOhm @ 10A, 10V
Power Dissipation (Max):
150W (Tc)
Package / Case:
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
TO-247-3
Operating Temperature:
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
150°C (TJ)
Mounting Type:
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Through Hole
Moisture Sensitivity Level (MSL):
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds:
2050pF @ 50V
Gate Charge (Qg) (Max) @ Vgs:
70nC @ 10V
FET Type:
FET Type refers to the specific type of Field-Effect Transistor (FET) used in an electronic circuit. FETs are semiconductor devices that control the flow of current using an electric field.
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Drain to Source Voltage (Vdss):
600V
Detailed Description:
N-Channel 600V 19.5A (Tc) 150W (Tc) Through Hole TO-247-3
Current - Continuous Drain (Id) @ 25°C:
19.5A (Tc)
The STW23NM60ND is , it is part of FDmesh™ II series. they are designed to work as Housingless Welding Diode.STW23NM60ND with pin details manufactured by . The STW23NM60ND is available in TO-247-3 Package,it is part of the electronic component Chips.that includes FDmesh™ II Series. they are designed to operate as Housingless Welding Diode.it is with Operating Temperature 150°C (TJ).STW23NM60ND with original stock manufactured by . The STW23NM60ND is available in TO-247-3 Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of STW23NM60NDis designed to work in TO-247-3, it's Operating Temperature is 150°C (TJ).The STW23NM60ND is available in TO-247-3 Package, is part of the Housingless Welding Diode and belong to RF Semiconductors.STW23NM60ND with EDA / CAD Models manufactured by . The STW23NM60ND is available in TO-247-3Package, is part of the RF Semiconductors.The STW23NM60ND is Housingless Welding Diode with package TO-247-3 manufactured by . The STW23NM60ND is available in TO-247-3 Package, is part of the .
STW23NM60ND More Descriptions
N-channel 600 V, 0.150 Ohm, 19.5 A, FDmesh II Power MOSFET
Power Field-Effect Transistor, 19.5A I(D), 600V, 0.18ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247
MOSFET, N CH, 600V, 19.5A, TO 247; Transistor Polarity:N Channel; Continuous Drain Current Id:19.5A; Drain Source Voltage Vds:600V; On Resistance Rds(on):0.15ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs Typ:4V; Power Dissipation Pd:150W; Transistor Case Style:TO-247; No. of Pins:3; SVHC:No SVHC (19-Dec-2012)
