Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supplier Device Package
8-MSOP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
100EL
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3.3V 5V
Logic Type
Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.
Differential Receiver
RoHS Status
Non-RoHS Compliant
Description
The SY10/100EL16VA-VF are differential receivers equivalent to SY10/100EL16 or SY10/100EL16V with enhanced capabilities. They feature a higher DC gain on the QHG and /QHG outputs compared to the Q output. The SY10/100EL16VA have an identical pinout to the SY10/100 EL16 or SY10/100EL16V and provide a VBB output for single-ended applications or DC bias for AC coupling.
The SY10/100EL16VB are similar to the SY10/100EL16VA, with the /Q output provided for feedback purposes. The SY10/100EL16VC includes an EN input synchronized with the data input (D) signal, enabling glitchless gating of the QHG and /QHG outputs. When /EN is LOW, the input is passed to the outputs, and the data output equals the data input. When /EN goes HIGH, it forces QHG LOW and /QHG HIGH on the next negative transition of the data input. If the data input is LOW when /EN goes HIGH, the next data transition to HIGH is ignored, and QHG remains LOW and /QHG remains HIGH. The QHG and /QHG outputs remain disabled as long as /EN is held HIGH. The /EN input does not affect the /Q output, which passes the inverted data input regardless of /EN.
The SY10/100EL16VD provides flexibility in DIE form, 16-pin 150mil SOIC package, or 10-pin MSOP package. The 16-pin SOIC and 10-pin MSOP packages are suitable for prototyping DIE applications. The SY10/100EL16VE are similar to the SY10/100EL16VB, with the Q./Q output made available differently and VBB no longer provided. The SY10/100EL16VF are similar to the SY10/100EL16VC, offering the D, /D inputs instead of the Vee output.
Features
3.3V and 5V power supply options
250ps propagation delay
Enhanced differential receiver with high voltage gain
Ideal for pulse amplifier and limiting amplifier applications
Data synchronous Enable/Disable (EN) on QHG and /QHG for glitchless gating of outputs
Ideal for gating timing signals
Complete solution for high-quality, high-frequency crystal oscillator applications
Internal 75K Ohm input pull-down resistors
Available in 8 and 16-pin SOIC packages, 8 and 10-pin (3mm) MSOP, and DIE form
Applications
Pulse amplifiers
Limiting amplifiers
Crystal oscillator applications
Timing signal gating
