Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Through Hole
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
Full Brick
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-25°C~85°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
VI-200™ (150W)
Size / Dimension
4.60Lx1.86W x 0.79 H 116.8mmx47.2mmx20.1mm
Feature
OCP, OTP, OVP, SCP
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
Not Applicable
Applications
ITE (Commercial)
Power (Watts)
Power (Watts) is a measure of the rate at which electrical energy is transferred or consumed. In electronic components, it represents the maximum amount of power that the component can handle without being damaged. It is typically expressed in watts (W) and is determined by factors such as the component's voltage and current ratings, as well as its physical design and materials. Understanding the power rating of a component is crucial for ensuring its safe and reliable operation within a circuit.
150W
Additional Feature
REMOTE SHUTDOWN
Subcategory
Power Supply Modules
Max Power Dissipation
150W
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
1
Voltage - Isolation
Voltage - Isolation refers to the maximum voltage that can be applied between two points in an electronic component without causing electrical breakdown. It is a measure of the component's ability to withstand high voltages without allowing current to flow between the points. A higher voltage isolation rating indicates that the component can withstand higher voltages without failing.
3kV
Voltage - Input (Max)
36V
Output Voltage
Output Voltage is the voltage level produced by an electronic component when it is operating. It is typically measured in volts (V) and can be either positive or negative. The output voltage of a component is determined by its design and the input voltage applied to it. For example, a voltage regulator will produce a fixed output voltage regardless of the input voltage, while an amplifier will produce an output voltage that is proportional to the input voltage.
5.8V
Max Output Current
25.86A
Voltage - Input (Min)
18V
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
20.066mm
RoHS Status
Non-RoHS Compliant
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VI-BWV-CV-F1 More Descriptions
DC DC CONVERTER 5.8V 150W