Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
5-TSSOP, SC-70-5, SOT-353
Supplier Device Package
SMini5-G1
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Max Power Dissipation
150mW
Current Rating
Current Rating is the maximum amount of current that an electronic component can safely handle without overheating or failing. It is typically expressed in amperes (A) or milliamperes (mA). Exceeding the current rating can damage the component and potentially create a safety hazard. The current rating is determined by the physical characteristics of the component, such as its size, material, and construction.
-100mA
Transistor Type
Transistor Type refers to the specific type of transistor used in an electronic circuit. Transistors are semiconductor devices that act as switches or amplifiers, and different types have different characteristics and applications. Common transistor types include Bipolar Junction Transistors (BJTs), Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), and Insulated-Gate Bipolar Transistors (IGBTs). Each type has its own advantages and disadvantages, such as speed, power handling, and voltage range, and is suitable for specific applications.
2 PNP - Pre-Biased (Dual)
Collector Emitter Voltage (VCEO)
Collector-Emitter Voltage (VCEO) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor when it is in the off state. It is important to ensure that the VCEO rating of a transistor is not exceeded, as this can lead to damage to the device. The VCEO rating is typically specified in the datasheet for a transistor.
250mV
Max Collector Current
100mA
DC Current Gain (hFE) (Min) @ Ic, Vce
30 @ 5mA 10V
Current - Collector Cutoff (Max)
500nA
Vce Saturation (Max) @ Ib, Ic
250mV @ 300μA, 10mA
Collector Emitter Breakdown Voltage
50V
Voltage - Collector Emitter Breakdown (Max)
50V
Current - Collector (Ic) (Max)
100mA
Max Breakdown Voltage
50V
Frequency - Transition
80MHz
Resistor - Base (R1)
2.2kOhms
Resistor - Emitter Base (R2)
10kOhms
RoHS Status
RoHS Compliant
XP0111H00L OverviewThis product is manufactured by Panasonic Electronic Components and belongs to the category of Transistors - Bipolar (BJT) - Arrays, Pre-Biased. The images we provide are for reference only, for detailed product information please see specification sheet XP0111H00L or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of XP0111H00L. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
XP0111H00L More Descriptions
TRANS ARRAY PNP/PNP W/RES S MINI
TRANS PREBIAS DUAL PNP SMINI5