Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
16-SSOP (0.154, 3.90mm Width)
Supplier Device Package
16-QSOP
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
RoHS Status
RoHS Compliant
Description
TRAC family of Field Programmable Analog Devices
Integrated path from signal processing problems to silicon solutions
Top-Down, Structured design discipline
Computational Approach for rapid implementation, prototyping, and product release
Integrated Signal Processing problem solving process
Path to Custom Silicon for high-volume users
Requires program data loading at power-up
Runs from a split 5V supply
TRAC-S2 support circuit simplifies circuit integration and memory device interface
Features
Automatic program loading at power-up
Supply monitor function reloads program after power failure or fluctuation
User-defined frequency of on-chip oscillator
Automatic sensing of cascaded TRAC devices
Automatic clocking stop when program loading complete
Generation of TRAC supply voltages
User-defined ground voltage
Thermal shutdown function for protection against overheating
Full industrial temperature range
Applications
Simplifies designing TRAC circuits
Reduces component count and manufacturing costs
Enables simple connection of serial output EEPROM or other memory device to TRAC
Compatible with current and future TRAC devices
